Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Masaru Nonomura

Kiyoshi Arita

Tatsuhiro Mizukami

Hiroshi Haji

Seikou Abe

Yoshinori Isobata

Hiroaki Onishi

Masahiro Taniguchi

Mitsuru Ozono

Teruaki Kasai

Kentaro Nishiwaki

Tomonori Itoh

Kei Tsunemasa

There are prepared element characteristic informationobtained by previously, individually measuring light emission characteristics of a plurality of LED elements and resin coating informationthat correlates an appropriate amount of resin to be applied for acquiring an LED package exhibiting a specified light emission characteristic and the element characteristic information. A map preparation processing sectionprepares, for each board, map datacorrelating mounting position informationshowing position of the LED element mounted on the board by a component mounting device Mand the element characteristic information. There is updated the resin coating informationon the basis of an inspection result fed back to a resin coating device Mas a result of a completed product coated with a resin being inspected by a light emission characteristic inspection device M

LED package manufacturing system

In resin coating used for manufacturing the LED package in which the LED elements is covered with a resin containing a phosphor, a translucent membercoated with a resinon trial as light emitting characteristic measurement is mounted on a translucent member mounting unithaving a light source unit, and an excitation light emitted from the light source unit is irradiated onto the resincoated on the translucent member, and a deviation between a measurement result obtained by measuring the light emitting characteristics of a light emitted by the resinby a light emitting characteristic measurement unitand light emitting characteristics specified in advance is obtained, and an appropriate resin coating amount of the resin to be coated on the LED elements as real production is calculated on the basis of the deviation.

LED package manufacturing system and resin coating method in LED package manufacturing system

In a resin coating which is used in the manufacture of an LED package which is made by covering an LED element with resin that includes fluorescent substance, a light-passing member () on which the resin () is test coated for light emission characteristic measurement is carried on a light-passing member carrying unit (), a deviation between a measurement result obtained after the light emission characteristic of the light that the resin () emits, when an light source unit (), which is placed above, emits excitation light which excites the fluorescent substance, and irradiates the excitation light from above to the resin () which is coated on the light-passing member (), is measured and the light emission characteristic prescribed beforehand is obtained, and an appropriate resin coating quantity with which the resin should be coated on the LED element is derived for practical production based on the deviation.

Resin coating device and a resin coating method

A translucent memberthat has been trial-coated with a resinfor measurement of a light emission characteristic is placed on a translucent member placement portion, an excitation light that excites a phosphor is emitted from a light source unitdisposed above, the resincoated on the translucent memberis irradiated with the excitation light from above, a deviation between a measurement result obtained by measuring the light emission characteristic of the light emitted from the resin, and a light emission characteristic specified in advance is obtained, and an appropriate resin coating amount of the resin to be coated on the LED element for actual production is derived on the basis of the deviation.

Resin coating device, and resin coating method

In resin coating, carrying a light-passing member test-coated with a resin on a light-passing member carrying unit; making a light source placed above the light-passing member carrying unit emit excitation light exciting the fluorescent substance; measuring light emission characteristics of the light by irradiating the excitation light emitted from the light source unit from above to the resin coated onto the light-passing member and receiving the light that the resin emits from below the light-passing member by a light emission characteristic measurement unit; obtaining a deviation between a measurement result of the light emission characteristic measurement unit and a prescribed light emission characteristic; and deriving the appropriate resin coating quantity of the resin to be coated onto the LED element as what is used for practical production based on the deviation.

LED package manufacturing system and resin coating method for use in LED package manufacturing system

An object is to provide a plasma processing device capable of accurately judging whether or not the proper maintenance time has come which is necessary for maintaining an operation state of a device in the best condition. A discharge detection sensor, in which a dielectric memberand a probe electrode unitare combined with each other, is attached to an opening portionprovided in a lid portioncomposing a vacuum chamber. A change in the electric potential induced in the probe electrodeaccording to a change in plasma discharge is received and whether or not the maintenance work is necessary is judged by comparing a counted value, which is obtained when a leak discharge wave-form countercounts the number of times of the detection of detecting a V-type wave form of a V-shaped specific pattern, which is caused by leak discharge correlated with the attachment of foreign object in the vacuum chamber, by a V-type wave-form detecting portion, with an allowable value which has been previously set by a maintenance judging portion

Plasma processing device

An object is to provide a plasma processing device capable of properly monitoring a state of plasma discharge and detecting a precursor to abnormal discharge, and a method of monitoring the state of discharge in the plasma processing device. In analysis processing for monitoring executed by detecting, by a signal analyzing portion, a signal of a potential change induced in a discharge detection sensorin response to a change in plasma discharge of the inside of a processing chamber and recorded in a signal recorder, based on a counter value Nobtained by detecting a signal of abnormal discharge (first arc discharge) generated between an electrode portion and an object to be processed by a first detectorand a counter value Nobtained by detecting a signal of micro-arc discharge (second arc discharge) generated by deposition of a foreign substance in the processing chamber by a second detector, an abnormal discharge determining portioncalculates a difference (N&#x2212;N) and compares the difference (N&#x2212;N) with a threshold value afor determination and determines whether there is a possibility of generation of abnormal discharge in the processing chamber.

Plasma processing device and method of monitoring discharge state in plasma processing device

An object is to provide a plasma processing device capable of rightly monitoring existence of plasma discharge and also rightly monitoring existence of abnormal discharge. Another object of the present invention is to provide a method of monitoring a state of plasma discharge in the plasma processing device. A discharge detection sensor, in which a dielectric memberand a probe electrode unitare combined with each other, is attached to an opening portionprovided in a lid portioncomposing a vacuum chamber. A change in the electric potential induced in the probe electrodeaccording to a change in plasma discharge is received, electric potential change wave-forms of specific patterns are respectively detected by an N-type wave-form detecting portionand V-type wave-form detecting, and a discharge state judgment including a judgment of whether the electric discharge exists or does not exist and whether the electric discharge is normal or abnormal is made according to a counted value of counting the number of times of appearance of these electric potential change wave forms for each type of wave-form by a discharge ON wave-form counter, a discharge OFF wave-form counter, an abnormal discharge wave-form counterand a leak discharge wave-form counter

Plasma processing device and method of monitoring plasma discharge state in plasma processing device

Provided is a component bonding method of bonding a semiconductor component having a thermosetting adhesive layer formed on a lower surface thereof to a circuit board having a resin layer formed on a surface thereof. In the method, wettability is improved by surface modification that performs a plasma treatment on a resin surface of the circuit board, the semiconductor component is held by a component holding nozzle having a heater, the adhesive layer is contacted to the surface-modified resin layer, and the adhesive layer is heated and thermally cured by the heater. Thereby, adhesion between the adhesive layer and the resin surface is improved, and thus the component holding nozzle can be separated from the semiconductor component without wait for completely hardening the adhesive layer. Accordingly, it is possible to improve productivity in the heat pressing process by reducing the time required for the component bonding.

Component bonding method, component laminating method and bonded component structure

An object is to provide a plasma processing device capable of highly accurately monitoring an operation state including whether or not the plasma discharge is executed, whether the discharge is normal or abnormal and whether or not the maintenance work of the vacuum chamber is necessary. A discharge detection sensor, in which a dielectric memberand a probe electrode unitare combined with each other, is attached to an opening portionprovided in a lid portioncomposing a vacuum chamber. A change in electric potential induced according to a change in plasma discharge in a probe electrode is received by a plurality of wave-form detecting portions and a detection signal is outputted each time a change in electric potential agreeing with a predetermined different condition appears. The detection signal outputted from the corresponding wave-form detecting portion is counted by the plurality of wave-form detecting portions and the counted value is held. According to the counted value, an operation state is highly accurately monitored which includes whether or not the plasma discharge is executed, whether the discharge is normal or abnormal and whether or not the maintenance work of the vacuum chamber is necessary.

Plasma processing device and plasma discharge state monitoring device

A plasma processing apparatus includes: a vacuum chamber; a plasma processing execution portion; a discharge state detecting unit; a window portion; a camera; a first storing portion; a second storing portion; and an image data extracting unit. The image data extracting unit extracts at least moving image data, which show the generation state of the abnormal discharge, from the first storing portion and stores the extracted moving image data in the second storing portion when the discharge state detecting unit detects the abnormal discharge.

Plasma processing apparatus

A device for resin coating is used for producing an LED package including an LED element covered with resin containing phosphor. In a state in which a trial coating materialis located by a clamp unit, a trial coating of resin applied to the trial coating materialis irradiated with excitation light and light emitted from the phosphor contained in the resin is measured by an emission characteristic measuring unit. A deviation of the measurement result of the emission characteristic measuring unit from a prescribed emission characteristic is determined, and then a proper amount of resin to be applied to the LED element is derived for actual production based on the deviation.

Method and device for resin coating

A plasma processing apparatus includes a vacuum chamber, a plasma processing execution portion, a discharge state detecting unit, a window portion, a camera, a first storing portion, a second storing portion and an image data extracting unit. When an abnormal discharge is detected, the image data extracting unit extracts at least moving image data showing a generation state of the abnormal discharge from the first storing portion and stores the extracted moving image data in the second storing portion. When plasma processing is ended without the detection of the abnormal discharge, the image data extracting unit extracts, from the first storing portion, moving image data of a predetermined specific period or still image data of a specific period derived from the moving image data of the first storing portion and stores the extracted moving image data or the extracted still image data in the second storing portion.

According to the plasma treatment on an object accommodated in the processing room, the plasma treatment is carried out as follows. The discharge detecting sensor detects a signal of potential change caused with change in plasma discharge. Receiving the signal, the signal recording section temporarily records the signal as signal data indicating potential change. Referencing the signal data, the signal analysis section extracts index data. The index data shows a condition of plasma discharge, for example, as a count value for discharge-start waves, a count value for abnormal discharge, a count value for feeble arc discharge. The device control section judges a condition of plasma discharge by monitoring the index data and carries out the retry process, the accumulative plasma process, and the maintenance judgment process for performing plasma treatment operations properly.

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Osaka, Japan

Masaru Nonomura