Denso Corporation

Toyota Jidosha Kabushiki Kaisha

Masaru Miyazaki

Tomohisa Sano

Akira Nakasaka

Hideaki Tachibana

Kenichi Oohama

Kentaro Hirose

A power conversion device includes a semiconductor unit, a terminal unit, a capacitor unit, a control board, and a case. The semiconductor unit is arranged at a position facing a plate surface of the control board. The terminal unit and the capacitor unit are arranged side by side in a x direction along the plate surface of the control board on the opposite side of the control board with respect to the semiconductor unit. At least a part of the capacitor unit or the terminal unit is located outside a first end of the semiconductor unit in the x direction. A first recess in which a first electrical wiring is arranged is formed in a portion of the case facing the first end so as to be recessed inside the case.

Power conversion device with effective vehicle space utilization

A power conversion device has semiconductor modules, a cooling unit, a capacitor module, a discharge resistance substrate, a control circuit substrate and a casing. The semiconductor modules from a power conversion circuit. The capacitor module is electrically connected to the semiconductor module. The discharge resistance is arranged on the discharge resistance substrate, and electrically discharges the capacitor module. The control circuit substrate controls operation of the semiconductor modules. The casing accommodates the semiconductor module, the cooling unit, the capacitor module, the discharge resistance substrate and the control circuit substrate. The discharge resistance substrate is arranged between an outer wall surface of the capacitor module and the control circuit substrate and arranged in a direction perpendicular to the control circuit substrate so that the discharge resistance substrate is separated in position from the outer wall surface of the capacitor module and the control circuit substrate.

Power conversion device

The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

Growing community of inventors

Kariya, Japan

Masaru Miyazaki