Seiko Epson Corporation

Masaru Mikami

Juichiro Matsuzawa

Shinya Aoki

Osamu Kawauchi

Akinori Yamada

Toshiya Usuda

Shuhei Yoshida

A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on the rear surface which is welded with the base, and an opening area of the groove on the inner space side which is greater than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed.

Manufacturing method of electronic device, electronic device, electronic apparatus, moving object, and lid body

A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on a surface which is welded with the base, and an opening area of the groove on the inner space side which is smaller than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed.

A circuit substrate includes a base substrate provided with a first pad and a second pad which are electrically connected to an electronic component, a first lateral face and a second lateral face, a first terminal electrically connected to the first pad and a second terminal electrically connected to the second pad which are disposed on the first lateral face, and a third terminal and a fourth terminal which are disposed on the second lateral face. The first terminal and the fourth terminal are located at point-symmetric positions to a center of the base substrate. The second terminal and the third terminal are located at point-symmetric positions to the center of the base substrate. The third terminal and the fourth terminal are electrically connected to each other.

Circuit substrate, electronic device, method of manufacturing electronic device, electronic apparatus, and moving object

A method of manufacturing an electronic device in which an inner space for housing a gyro element is formed between a base and a lid and the base and the lid are bonded includes bonding the base and the lid in which a groove is provided on a surface to be bonded with the base so that the inner space communicates with the outside by not bonding the inner surface of the groove to the base and to position the groove around a concave portion provided on a side surface of the base, and closing a communication portion by irradiating a laser beam to the lid in the communication portion.

Method of manufacturing electronic device, electronic device, electronic apparatus, and moving object

A base member includes a mounting area where an electronic component can be mounted and a ring-shaped sealing surface surrounding the area as the area is viewed in a plan view. A sealing member is fixed on the sealing surface. A through-hole portion which is a recess partitioned by a wall surface of the sealing member and which connects the mounting area and an outer peripheral side of the sealing surface as viewed in a plan view is provided on the sealing surface. A manufacturing method for an electronic device using this base member is also provided.

Base member, manufacturing method for electronic device, and electronic apparatus

A resonator element includes a base section, at least one pair of vibrating arms protruding from the base section, a support arm protruding from the base section, and a first through hole provided to the support arm, and penetrating the support arm in a thickness direction, and is fixed to an object via an adhesive entering the first through hole.

Resonator element, resonator, oscillator, and electronic apparatus

A resonator element includes a base section, a pair of vibrating arms projecting toward the same side from the base section, and disposed side by side in a predetermined direction, a support arm projecting from the base section toward the same side as the pair of vibrating arms, disposed between the pair of vibrating arms, and having a recessed portion disposed on one principal surface, and a first electrically-conductive pad and a second electrically-conductive pad disposed side by side across the recessed portion.

Resonator element, resonator, oscillator, electronic apparatus, and mobile object

A resonator element includes: a base portion, a first resonating arm that is extended from the base portion along a first direction, and a second resonating arm that is extended from the base portion along a first direction opposite to the first resonating arm, wherein the first resonating arm and the second resonating arm are arranged such that a base end portion of one side resonating arm and a middle portion of the other side resonating arm are arranged in the second direction orthogonal to the first direction.

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Minowa, Japan

Masaru Mikami