Sharp Kabushiki Kaisha Corporation

Masaru Iwasaki

Takashi Nukii

Shigeo Nakabu

Katunobu Awane

Shuhei Tsuchimoto

Hirokazu Yoshida

Toshimasa Hamada

Ryusuke Kita

Satoshi Nishigaki

Tetsuya Hanamoto

Shohichi Katoh

Masumi Nakamichi

Akiteru Rai

Takahiro Funakoshi

Koji Miyake

Yuji Matsuda

Yuzi Matsuda

Katsunobu Awane

Disclosed is a photodetector with a multilayer filter. A light-receiving substrate is mounted on a recessed portion of a ceramic stem. An electrode pad is formed on a P-type layer of the light-receiving substrate while another electrode pad is formed on an N-type layer of the light-receiving substrate. An optical multilayer filter is formed on the light-receiving substrate except the regions of the electrode pads. Further, an epoxy transparent resin is poured into the recessed portion of the stem and then cured, so that a resin portion to cover the light-receiving substrate is formed. The optical multilayer filter is formed of amorphous low refractive index films made of SiC.sub.2 and amorphous high refractive index films made of TiO.sub.2. The amorphous high and low refractive index films are alternately stacked.

Photodetector with a multilayer filter and method of producing the same

A method for manufacturing a contact type one-dimensional image sensor, which includes the step of providing a light receiving element portion composed of one or more of Group II-VI compounds semiconductor containing Cd on a substrate, and also providing a matrix wiring portion on the same substrate as that of the light receiving element portion, and the method is characterized by the step of forming an insulating layer for the formation of the matrix wiring portion in such a manner as to cover the light receiving element portion.

Method of manufacturing contact type one-dimensional image sensor

A substrate for wiring an electrical component with an external circuit, comprises a base plate for accommodating the electrical component therein, a first insulation layer made of an organic material formed on the base plate, a first wiring formed on the first insulating layer, a second insulation layer made of an organic material formed on the first wiring, a second wiring formed on the second insulation layer, the second wiring being coupled to the electrical component, the base plate, the first insulation layer, the first wiring, and the second insulation layer being bent at the marginal edges thereof, in which portions of the first wiring on the bent portions are made of a material having a low temperature of recrystallization.

Metal-based organic film substrate

A substrate for wiring an electrical component in an electrical circuit comprises a base substrate, a first insulating layer of an organic material formed over the base substrate, a wiring member formed on the first insulating layer, coupled to the component, a second insulating layer of an organic material formed over the first insulating layer, and a terminal member on the first insulating layer and appearing from the second insulating layer, connected to the wiring member. A third insulating layer of an organic material may be interposed between the first and the second insulating layers, carrying a second wiring member connected to the first wiring member.

Thin assembly for wiring substrate

A display module comprises a display device for displaying visual information, an electrode disposed on the display device, a circuit board for carrying wiring lines connected to circuit elements for driving the display deivce, and a conductive elastomer body for connecting the wiring lines and the electrode, the conductive elastomer body being placed between the electrode and a curled edge a flange of the circuit board. In a specific form, the display device is a liquid crystal display cell.

Thin structure of display panel

A high-insulation adhesive sheet is formed on a metal substrate. Bottom conductors are formed on the high-insulation adhesive sheet. A high-insulation organic layer is formed on the high-insulation adhesive sheet and the bottom conductors, and top conductors are formed thereon. The high-insulation organic layer is tightly attached to the metal substrate via the high-insulation adhesive sheet. The bottom conductors and the top conductors are communicated to each other via through holes formed in the high-voltage organic layer.

High-insulation multi-layer device formed on a metal substrate

Growing community of inventors

Izumisano, Japan

Masaru Iwasaki