Honda Motor Co., Ltd.

Kaijo Corporation

Gsi Creos Corporation

Masaru Ishibashi

Takashi Yanagisawa

Yoshiyuki Morita

Hiromi Fujisawa

Ayako Omori

Rei Imai

Masanori Tomita

A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire includes a ball bonded to the first bonding point, a neck portion adjacent to the ball and a major portion extending from the neck portion to the second bonding point. The neck portion includes a riser part which extends, from the bonded ball, obliquely upward in a direction toward the second bonding point, and the riser part is formed by a top portion of the ball which has entered an opening of a capillary and been shaped at the time of ball bonding. The riser part is formed by inclining the top portion of the ball, which enters the opening of the capillary at the time of ball bonding, which inclining is done by moving the capillary obliquely upward toward the second bonding point.

Wire loop, semiconductor device having same and wire bonding method

Carbon nanotubes, which carry surface functional groups on side walls thereof relative to lengths thereof, and a dispersant are added to a base liquid to provide a heat transport medium capable of achieving high heat conductivity while suppressing an increase in kinetic viscosity.

Heat transport medium

Growing community of inventors

Tokyo, Japan

Masaru Ishibashi