Fuji Electric Co., Ltd.

Masaoki Miyakoshi

Rikihiro Maruyama

Takeshi Yokoyama

Kazuya Adachi

Masayuki Soutome

Shoji Sakaguchi

Jun Natsume

A semiconductor device includes a conductive board, a contact component having a cylindrical through hole and including a main body portion with first and second open ends, and an external connection terminal inserted in the through hole of the contact component, having four outer surfaces extending in an insertion direction to form a quadrangular prism shape, and having four corner portions along an insertion direction pressed by an inner circumferential surface of the through hole of the contact component. The external connection terminal has protrusions, each of which is disposed on a respective one of at least one pair of opposite outer surfaces among the four outer surfaces, and being pressed by the inner circumferential surface of the through hole.

Semiconductor device

A method of manufacturing a semiconductor device prepares contact members, each of which has a cylindrical through-hole, and column-shaped connection terminals, each having a polygonal shape in a cross-sectional view along a length direction thereof, wherein a length of a diagonal of the polygonal shape is greater than an inner diameter of the through-holes. Chamfers with a curvature for fitting an inner surface of the through-holes are formed at corners of the connection terminal, and the connection terminals are press-fitted into the through-holes of the contacts. By doing so, the area of contact where the connection terminals press-fitted into the contacts contact the inner circumferential surfaces of the through-holes of the contacts is increased. This increases the tensile load of the connection terminals fitted into the contacts.

Semiconductor device manufacturing method and semiconductor device

A semiconductor device includes: a multilayer substrate which includes a circuit board and an insulating plate on which the circuit board is formed; and a contact part having a cylindrical hollow hole therein and an open end bonded to a bonding area on the front surface of the circuit board via bonding material. In the case of this semiconductor device, wettability of a contact area of the contact part with respect to the bonding material is approximately equal to wettability of at least the bonding area of the circuit board with respect to the bonding material. Thus, the rising of the bonding material into the hollow hole of the contact part during heating performed when the contact part is bonded to the circuit board is reduced.

Semiconductor device having circuit board to which contact part is bonded

A semiconductor device in which the electrical connection is established using conductive pins and a printed wiring board, wherein the printed wiring board is mounted parallel to an insulated circuit board to prevent poor bonding of the conductive pins. A third-type conductive pin is arranged in such a manner as to be connected to a first metal layer at a position farther than a first-type conductive pin arranged at a position farthest from a side that is in contact with a gap between island regions. Similarly, another third-type conductive pin is arranged in such a manner as to be connected to another first metal layer at a position farther than another first-type conductive pin arranged at a position farthest from another side that is in contact with the gap between the island regions.

A method of manufacturing a perpendicular magnetic recording medium substrate is capable of reducing the waviness of all wavelength components and a recording medium is capable of reducing contact with a magnetic head to improve the flying stability of the magnetic head. The method includes two polishing operations. The first operation includes polishing a substrate having a Ni&#x2014;P-based alloy underlayer with a first porous material that includes 0.1 wt % to 25 wt % of alumina, titania, silica, and zirconia abrasive while supplying a first slurry liquid including an organic or inorganic acid and a first abrasive to the underlayer of the substrate. The second operation includes polishing a surface of the underlayer polished in the first polishing with a second porous material while supplying a second slurry liquid including an organic or inorganic acid and a second abrasive with a grain diameter smaller than that of the first abrasive.

Method of manufacturing perpendicular magnetic recording medium substrate and perpendicular magnetic recording medium substrate manufactured by the same

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Matsumoto, Japan

Masaoki Miyakoshi