Sharp Kabushiki Kaisha Corporation

Masao Yamazaki

Junichi Naemura

Mamoru Okanishi

Terumitsu Santo

Kenzo Nozaki

Fumitoshi Yoshimura

Junji Ogawa

An object of the invention is to surely bond a semiconductor chip onto a chip substrate by heat-melting a brazing filler metal as required. A die bonding apparatus which is provided with a substrate holder for holding a chip substrate, a collet for conveying and pressing a semiconductor chip onto the chip substrate held by the substrate holder, a heater for heat-melting a brazing filler metal interposed between the chip substrate and the semiconductor chip, a temperature sensor for detecting the heating temperature of the brazing filler metal, and controlling means for controlling the heater based on the temperature detected by the temperature sensor. The temperature sensor is disposed in the collet.

Die bonding apparatus

A semiconductor chip position detector including a transparent film on which semiconductor chips are placed, a film table on which the film is placed, a light source, optical fiber cables provided in the vicinity of the film table, by which light beams from the light source are radiated onto the semiconductor chips through the film having the semiconductor chips placed thereon, and a position recognition device provided above the film for recognizing the positions of the semiconductor chips based on shadow shapes of the semiconductor chips generated by the radiated light.

Semiconductor chip position detector

An image recognition apparatus includes a light source including a plurality of light emitting diodes having different wavelengths, for illuminating an object, a driver for selectively operating the light emitting diodes and adjusting the brightness thereof, an image pick-up device for photoelectrically transferring the light reflected from the object into an image signal, and an image decision device for comparing a reference image signal with the image signal obtained by the image pick-up device and then deciding whether an image corresponding to the obtained image signal is clearer than an image corresponding to the reference image signal, the image decision device making the driver sequentially operates the light emitting diodes and change the brightness thereof in such a manner that the image corresponding to the image signal is clearer than the image corresponding to the reference image signal.

Growing community of inventors

Nara, Japan

Masao Yamazaki