Toagosei Company, Ltd.

Masao Takei

Kaoru Kimura

Akira Sumi

Hiroshi Suzuki

Hiroshi Niizuma

Makoto Hirakawa

Takenao Hattori

A photosensitive resin composition which is excellent in storage stability required for one-part type compositions and in processability required for dry-film formation and gives a cured product suitable for FPC substrates or suspension substrates for hard-disc which each retains essential properties required for solder resists, such as heat resistance, water resistance, and electrical-insulation reliability, and has flexibility and low polluting property. The composition comprises: a compound which has a carbon-carbon double bond and carboxy group and is obtained by allowing a bisphenol type epoxy compound and an unsaturated monocarboxylic acid to react and then allowing a polybasic acid anhydride to undergo addition reaction with part or all of the secondary hydroxy groups of the reaction product; a urethane (meth)acrylate compound having a structure derived from a polycarbonate polyol structure; another polymerizable compound having a carbon-carbon double bond; and a photopolymerization initiator.

Photosensitive resin composition, composition for solder resist, and photosensitive dry film

The present invention provides an organopolysiloxane having acryloyl groups or methacryloyl groups at both terminals thereof, where silicon atoms at both terminals of the organopolysiloxane are each independently added to double bonds each of acryloyl groups or methacryloyl groups of compounds each having at least two acryloyl groups or methacryloyl groups; a curable resin composition comprising such an organopolysiloxane; and a process for producing such an organopolysiloxane comprising adding a compound having at least two acryloyl groups or methacryloyl groups to an organopolysiloxane having SiH groups at only both terminals thereof. The curable resin composition has distinguished transparency, luster, peelability, surface lubricity and water and oil repellency, and therefore is useful as a resin for mold-releasable paper, a coating agent, an anticorrosive agent for printed substrate, etc.

Organopolysiloxane

A process for the preparation of an organosilicon compound represented by formula (3): ##STR1## which process comprises reacting an organosilicon compound represented by formula (1) with a (meth)acrylic acid ester represented by formula (2) in the presence of a catalyst: ##STR2## The symbols in the above formulae are defined in the specification.

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Minato-ku, Japan

Masao Takei