Omron Corporation

Omron Healthcare Company Ltd.

International Business Machines Corporation

The Ritsumeikan Trust

The University of Shiga Prefecture

Masao Shimizu

Shinya Nakagawa

Tsuyoshi Hamaguchi

Minoru Taniguchi

Junichi Tanaka

Yoshitaka Adachi

Chisato Tawara

Sho Sasaki

Yasutaka Nishioka

Sadao Kawamura

Wataru Masuda

Hye Jong Kim

Yuki Sugano

Akinobu Kanai

Kiyoshi Yasutake

Kumayasu Yoshii

A soft gripper that surrounds and grips an outer peripheral surface of an object, the soft gripper includes an elongated first actuator and an elongated second actuator, which are deformed in response to supply of a fluid. The first actuator and the second actuator extend from bases of the first and second actuators toward opposite sides each other. When receiving the supply of the fluid, each of the first and second actuators sequentially surrounds the object from the base toward a side of a leading end of the each of the first and second actuators.

Soft gripper and blood pressure measuring cuff comprising the same

A force detector includes a support, fluid bags, a contact portion, a detector, and a computer. The contact portion is opposite to a side on which the fluid bags are in contact with the support and is adjacent to the fluid bags. The computer obtains information regarding the internal pressures of the fluid bags from the detector. Upon application of an external force to the contact portion from an object, the computer calculates a force acting in a tangential direction on a contact surface between the object and the contact portion based on a difference between the internal pressures of the fluid bags.

Force detector

An internal temperature measuring apparatus includes: a sensor package in which a MEMS chip and a temperature sensor are disposed in a bottomed tubular package, the MEMS chip including one or a plurality of thermopiles each of which measures a heat flux passing through a region of a bottom of the bottomed tubular package, the temperature sensor measuring a reference temperature used as temperature of a predetermined portion of the MEMS chip; and a printed circuit board configured to calculate the internal temperature of the measurement object based on output of the sensor package. An outer bottom face of the sensor package projects from a plate face of the printed circuit board through a through-hole made in the printed circuit board.

Internal temperature measuring apparatus and sensor package

Provided is a sensor package that measures an internal temperature of a measurement object. A sensor package includes: a package including a bottomed tubular casing and plural leads substantially parallel to each other, each of the leads piercing the bottomed tubular casing; and a MEMS chip including at least one thermopile that measures a temperature difference in an identical direction. The MEMS chip is disposed in an inner bottom surface of the bottomed tubular casing of the package in a posture in which a measurement direction of the temperature difference measured with the thermopile is substantially orthogonal to a longitudinal direction of each lead.

Sensor package

Provided is an internal temperature measurement device capable of measuring an internal temperature of a measuring object for which the thermal resistance value of a non-heating body present on the surface side of the object is unknown, more accurately with better responsiveness than hitherto. The internal temperature measurement deviceincludes a MEMS chipincluding: two cellsfor measuring two heat fluxes for calculating an internal temperature of a measuring object for which the thermal resistance value of a non-heating body is unknown; and a cellfor increasing a difference between the heat fluxes.

Internal temperature measurement device

A method includes measuring a first temperature difference between first heat entry and discharge parts on a first heat transfer path extending from a portion of a surface of the object to the first heat discharge part using a first thermopile, and measuring a second temperature difference between a second heat entry and discharge parts on a second heat transfer path extending from another portion of the surface of the object to the second heat discharge part using a second thermopile, and measuring a reference temperature at a predetermined position on the first or second heat transfer path using a temperature sensor, and calculating the internal temperature of the object using the measured first and second temperature differences, and the reference temperature, and at least one predetermined value excluding a physical property value of a non-heating part of the object located at a surface side of the object.

Internal temperature measurement method and internal temperature measurement device

An internal temperature sensor includes substrates with one surface to be placed in contact with a measurement surface of an object to measure an internal temperature of the object, a heat flux sensor on another surface of the substrates, and a temperature sensor. The heat flux sensor is fabricated through a MEMS process and includes first and second temperature measurement parts, and a thin film including a thermopile to detect a temperature difference between the first and second temperature measurement parts. The thin film is supported by a thermally conductive member to form a space between the first temperature measurement part and the substrates and to extend parallel to the substrates. The thermally conductive member conducts heat traveling from the object through the substrates to the second temperature measurement part. The temperature sensor measures the temperature of a part of the substrates that is in contact with the thermally conductive member.

MEMS internal temperature sensor having thin film thermopile

A sensor package has a semiconductor sensor chip, and a package body that has a semiconductor sensor chip mounting region on which the semiconductor sensor chip is mounted. The package body being a resin injection molded product. A groove is formed in a rear surface on an opposite side to a surface, on which the semiconductor sensor chip is mounted, so as to surround the semiconductor sensor chip mounting region. A coupling section is formed in the rear surface to couple a resin portion inside the groove and a resin portion outside the groove.

An accurate dry etching technique is described that employs a flow of neutral radicals and a light beam. A dry etching apparatus employs a neutral radical flow source and a light beam to irradiate a flow of neutral radicals , so that the velocity component of the neutral radicals parallel to the surface of an object to be etched is reduced, and etches anisotropically the object to be etched, while the object is exposed to the radical flow whose parallel velocity component is decreased. The invention reduces the problem of etching parallel to the substrate while etching perpendicular to the substrate to improve anisotropic dry etching without any adverse or damage producing effect to dielectric or semiconductor layers due to ions.

Growing community of inventors

Moriyama, Japan

Masao Shimizu