Sekisui Chemical Co., Ltd.

Masao Sasadaira

Takeshi Wakiya

Satoshi Haneda

Yasuyuki Yamada

Saori Ueda

Mai Yamagami

Xiaoge Wang

Hiroyuki Nomoto

A sintered material excellent in thermal stress and bonding strength; a connection structure containing the sintered material; a composition for bonding with which the sintered material can be produced; and a method for producing the sintered material. The sintered material has a base portion, buffer portions, and filling portions. The buffer portions and filling portions are dispersed in the base portion. The base portion is a metal sintered body, each buffer portion is formed from a pore and/or material that is not the same as the sintered body, and each filling portion is formed from particles and/or fibers. The sintered material satisfies A>B. A is the kurtosis of volume distribution of the base portions in a three-dimensional image of the sintered material. B is the kurtosis of volume distribution of the base portions in a three-dimensional image of the sintered material from which the filling portions are removed.

Sintered material, connection structure, composite particle, joining composition, and method for manufacturing sintered material

Provided is a conduction inspection device member, wherein cracks and voids are less likely to form in conductive parts, conduction performance is less likely to be impaired even when a conduction test is repeated, and contact marks are less likely to remain in the portion of the member in contact with a member to be tested. Also provided is a conduction inspection device comprising the conduction inspection device member. The conduction inspection device member comprises a substrate, through holes, and conductive parts. The multiple through holesare arranged in the substrate, the conductive partsare housed inside the through holes, and the conductive partscontain conductive particles. The conductive particleseach comprise a substrate particleand a conductive layeron the surface of the substrate particle. The conductive layerhas multiple protrusionson the outer surface thereof.

Conduction inspection device member and conduction inspection device

Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 &#x3bc;m or more and 15 &#x3bc;m or less, the particles have a 10% K value of exceeding 3000 N/mmand 20000 K/mmor less, and the particles have a particle diameter CV value of 50% or less.

Particles, connecting material and connection structure

A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 &#x3bc;m or more and 300 &#x3bc;m or less, the particles have a 10% K value of exceeding 3000 N/mmand 20000 N/mmor less, and the particles have a particle diameter CV value of 10% or less.

Connecting material and connection structure

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 &#x3bc;m or more and 300 &#x3bc;m or less, the particles have a 10% K value of 30 N/mmor more and 3000 N/mmor less, and the particles have a particle diameter CV value of 10% or less.

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 &#x3bc;m or more and 15 &#x3bc;m or less, the particles have a 10% K value of 30 N/mmor more and 3000 N/mmor less, and the particles have a particle diameter CV value of 50% or less.

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Shiga, Japan

Masao Sasadaira