Nihon Denshizairyo Kabushiki Kaisha

Japan Electronic Materials Corporation

Fuji Xerox Co., Ltd.

Hagiwara Research Corp.

Other

Mitsubishi Denki Kabushiki Kaisha

Fujifilm Business Innovation Corp.

Japan Electronic Materials Corportion

Masao Okubo

Kazumasa Okubo

Hiroshi Iwata

Nobukazu Takahashi

Yasuro Yoshimitsu

Kiyoshi Sugaya

Zenji Hagiwara

Toshinori Takagi

Noriaki Kojima

Kimihiro Wakabayashi

Junzo Ishikawa

Makoto Fuchigami

Yoshikazu Okamoto

Yasuaki Miyazawa

Mari Horie

Hiroshi Murano

Dai Sasaki

Naoki Koike

Kazunori Numao

Masaki Suda

Kouji Katahira

Nobuyuki Murakami

Oliver R Garretson

Fumio Nakai

A design support system includes memory, a receiving unit, and an associating unit. The memory stores information on design element classification that classifies a design element included in a product, and information on design requirement classification that classifies a design requirement required for the product. The receiving unit receives technical information regarding a design trouble. The associating unit refers to technical information regarding a design trouble, received by the receiving unit, and associates a classification item in the design requirement classification to which the design trouble belongs and a classification item in the design element classification to which a design element causing the design trouble belongs with each other, along with information on a phenomenon indicating a failure status of the design element included in the technical information.

Support system and non-transitory computer readable medium

A design support system includes a storage unit, an accepting unit, a selecting unit, and an associating unit. The storage unit stores information regarding design element classifications into which design elements constituting a product are classified and design requirement classifications into which design requirements required for the product are classified. The accepting unit accepts technical information regarding a trouble due to design. The selecting unit refers to the technical information regarding the trouble, selects a classification item to which the trouble belongs from among the design requirement classifications, and selects a classification item to which a design element that has caused the trouble belongs from among the design element classifications. The associating unit associates the classification item of the design requirement classifications with the classification item of the design element classifications with regard to the design element classifications and the design requirement classifications stored in the storage unit.

Purpose: To present a vertical probe card capable of reusing without replacing a broken probe if a probe is broken. Constitution: A vertical probe card having vertical probes, being used in measurement of electric characteristics of an LSI chipto be measured, comprising a main substrateforming conductive patterns, a plurality of probesdrooping vertically from the main substrate, and a probe supportprovided at the back side of the main substratefor supporting the probes, in which the probe supportis disposed parallel to the main substrate, and has an upper guide plateand a lower guide platefor supporting the probesby passing the through-holesopened in each, and the lower guide plateis composed of three substratesA,B,C laminated separably.

Vertical probe card

When continuously outputted pulses from a first pulse to an (N&plus;1)th (where N is an integer) are received, a pulse specifying circuit specifies a number N of a pulse whose properties are to be measured. Further, a gate generating circuit generates a gate signal which is at high level during a period from the end of the (N&minus;1)th pulse to the start of the Nth pulse and which is at low level during a period from the end of the Nth pulse to the start of the (N&plus;1)th pulse. A semiconductor evaluating apparatus measures the width of the Nth pulse based on the generated gate signal.

Gate signal generating circuit, semiconductor evaluation apparatus, and semiconductor evaluating method

A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe. Next configuration features in including: two kinds of probes; measurement probes and connection probes anew, and a plurality of connection probes include buckling portions to buckle, upon a contact by an end of contact portion onto the wiring pattern provided with the first board when inserted into holes provided with the a second board; wherein through holes provided with the second board are positioned to align to the arrangement of wiring pattern provided with the first board. Thereby, undesirable deviation of contact point by the probe is avoided and a suitable contact pressure is preferably kept, and further convenience in the work of exchanging damaged probes is brought about.

Probe, manufacture of same, and vertically operative type probe card assembly employing same

Probe for testing a semiconductor integrated circuit

A method of reforming a tungsten probe tip includes forming a non-oxidizing metallic film on the surface of the tungsten probe tip, heating the film in a non-oxidizing atmosphere or vacuum, and diffusing the film into the tungsten probe tip. The non-oxidizing metallic film can be formed from a metal such as gold, platinum, rhodium, palladium, and iridium. The reformed tungsten probe tip can be used in low voltage and low current testing, and has excellent abrasion resistance, conductivity and oxidation resistance.

Method of reforming a tip portion of a probe

An image forming apparatus includes: a latent image carrier 1 to form a latent image in accordance with an image signal; a developing unit 14 to develop the latent image with a predetermined toner; an intermediate transfer body 2 coming into contact with the latent image carrier 1 so that the intermediate transfer body can be rotated together with the latent image carrier, the intermediate transfer body being capable of transferring a toner image formed on the latent image carrier 1; a transfer roller 4 to simultaneously transfer the toner image held on the intermediate transfer body 2 onto a recording medium 11; and a transfer roller 3 arranged in the downstream close to a contact region (nip portion) of the latent image carrier 1 with the intermediate transfer body 2, the transfer roller 3 being arranged on a side of the intermediate transfer body 2 reverse to a toner image holding surface so as to transfer the toner image on the intermediate transfer body 2 by forming a transfer electric field between the latent image carrier 1 and the intermediate transfer body 2 when a voltage, the polarity of which is opposite to the electrical charging polarity of the toner image, is impressed.

Image forming apparatus having a transfer member positional downstream

An image forming apparatus of such a type as is provided with a photosensitive member having a semi-conductive intermediate transfer member disposed opposite the photosensitive member. A charger electrically charges the photosensitive member. An exposure device forms an electrostatic latent image on the photosensitive member and developer visualizes the electrostatic latent image using toner identical in polarity to the photosensitive member. A primary transfer device transfers the toner image to the intermediate transfer member by applying a bias opposite in polarity to the photosensitive member, and a secondary transfer apparatus transfers the toner image on the intermediate transfer member to a transfer material. An optical charge-eliminator optically removes the electrical charge from the photosensitive member. A contact charge-eliminator is provided between the optical charge-eliminator and the primary transfer device so as to completely eliminate the electric charge injected into the photosensitive member at the time of the primary transfer.

Image forming method and apparatus having a semiconductive intermediate

Probe card is a part which is incorporated into a probing equipment to test finished IC chips, This card is customarily mounted with a plurality of probes, very fine needle and generally bent, and each probe is disposed so that its front end may pinpoint to a pad of an IC chip of interest. In performing the probing test, a most important condition is to keep the probe contact pressure on the pad of an IC chip at a constant position during measurement time, but in performing such at a high temperature, heated IC chips radiate the probe card and thereby positional deviation of the contact point is caused by heat expansion of the probe card and hence the contact pressure may change. The invented probe card employs a ceramic material in fabricating the probe card for possessing a very low expansion coefficient or for possessing an equivalent coefficient value to the IC chip or wafers, thereby the positional deviation of the probe contact is avoided and other devices to cope with difficulties caused by performance at a high temperature are disclosed.

Probe card for maintaining the position of a probe in high temperature

The invention provides a novel antibacterial compound and a process for producing it. Futhermore, the invention provides a novel antibacterial polymer composite comprising a polymer and the antimicrobial compositon.

Antimicrobial composition of aluminosilicate coated silica gel

A silica gel based heat-resistant and weatherproof antimicrobial composition having an aluminosilicate layer on the surfaces of pores in the silica gel as substituted by silver and an optional antimicrobial metal, said composition containing ion-exchangeable metals that are chiefly an alkali metal and that are present in an amount of up to 2.57 mmol per gram of said composition on an anhydrous basis.

Antimicrobial composition having resistance to heat and weathers

The present invention provides a novel antimicrobial composition and a process for preparing the composition which composition is useful as antimicrobial and/or bactericidal material. The antimicrobial composition of the invention comprises silica gel and an antimicrobial coat of aluminosilicate on the surface of the silica gel, said composition having a pore volume of at least 0.3 cm.sup.3 /g and a specific surface area of at least 100 m.sup.2 /g. The aluminosilicate coat consists of either partial or complete substitution of ion-exchangeable metal ion (M) in aluminosilicate solid particles represented by the formula

Silica-gel based antimicrobial composition having an antimicrobial coat

Probe card is a part which is incorporated into probing equipment to test finished IC chips. This card is customarily mounted with a plurality of probes, very fine needle and generally L letter shaped, each of which is disposed so that its front end may project downwardly toward an IC chip. Conventional probes are difficult to align all the probe front ends with electrical ends on the IC chip. Overdrive is normally taken to produce adequate contact pressures with respective probes after all contacts between the probe front ends and the IC ends are formed, but this action often causes conventional probe ends to slip down from the IC ends. The proposed probe card includes a new provision of a resin layer of an elastic, insulative characteristic to fill the central open area of the supporter which is assembled into the probe card. The filling, by such a resin layer, makes the probe front ends resiliently held in position so that a deviation from proper respective dispositions by overdrive becomes avoidable. The disclosure refers to additional devices to enhance the convenience in determining the alignment between the probe front ends and the IC ends, and also in obtaining accurate measurements of an IC chip under test.

Growing community of inventors

Nishinomiya, Japan

Masao Okubo