Mec Company Ltd.

Masao Okada

Daisaku Akiyama

Maki Arimura

Itsuro Tomatsu

Keisuke Joko

Yasutaka Amitani

Masayo Kuriyama

Tokuya Satomi

Yoichi Sengoku

Masaru Takahashi

Ryoko Mitani

The coating film-forming composition is a solution of pH 6 to 9 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and a halide ion. The content of polybasic acid in the coating film-forming composition is 0.05 to 10 times the content of aromatic compound, and the halide ion concentration is 5 to 600 mM. A coating film with excellent adhesion to a resin can be formed on a surface of a metal member by bringing the coating film-forming composition into contact with the surface of the metal member.

Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite

An etchant for copper or copper alloys comprising 5-50 wt % of an alkanolamine, a copper ion source in the amount of 0.2-10 wt % as copper, a halide ion source in the amount of 0.005-10 wt % as halogen, 0.1-30 wt % of an aliphatic carboxylic acid, and the balance water, wherein the molar ratio of the alkanolamine to one mol of the aliphatic carboxylic acid is two or more. The etchant is free from problems such as instability of the liquid composition and unpleasant odor, has a high etching rate, exhibits only very slight corrosion even if a small amount of residue is left on the surface and is capable of producing a roughened surface when used for microetching.

Etchant for copper or copper alloys

Growing community of inventors

Hyogo, Japan

Masao Okada