Matsushita Electronics Corporation

Toho Kinzoku Co., Ltd.

Masao Nakayama

Toshio Fujiwara

Kaoru Muramatsu

Isamu Yuasa

Katsuji Tara

Noboru Yoshida

Katsushi Tara

Yukio Nakamura

Naoyoshi Akiyoshi

Hiroyuki Yamabe

Katsumi Koda

Kimio Nakada

The semiconductor device of the invention includes: a square die pad, to which a semiconductor chip is adhered via a silver paste member or the like; first leads, the inner end of each of the first leads being formed continuously and integrally with an associated shorter side of the die pad; and a pair of second leads extending in an outer direction, the inner ends of the second leads interposing the die pad therebetween. The inner end of each of the second leads includes a width-increased end portion having a larger width and being formed to be parallel to an associated longer side of the die pad. A through hole is provided in a portion connecting the width-increased end portion to the outer portion of each of the second leads. The semiconductor chip is electrically connected to the second leads via wires and to the die pad via a grounding wire.

Lead frame for use with an RF powered semiconductor

Copper-tungsten alloys and their manufacturing methods

Semiconductor device

Growing community of inventors

Osaka, Japan

Masao Nakayama