Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Masao Nakano

Hiromasa Ashitani

Noboru Iida

Tsuyoshi Karino

Masafumi Fukushima

Akira Ikeda

A compressor, characterized in that a steel is used as the base material for the other sliding material vaneand nitrided, a CrN or DLC film is formed on the surface by PVD treatment, and a Ni&#x2014;Cr&#x2014;Mo cast iron is used for the other corresponding sliding material piston. It is possible in such a configuration to suppress the temperature rise by sliding friction of the sliding materials, such as the vane tip regionand the peripheral region of pistonthat are vigorously slid, relax decomposition of the refrigerant, and suppress corrosion by hydrogen fluoride generated in reaction with water and oxygen, and thus to provide a compressor higher in reliability.

Compressor with steel and cast iron sliding materials

A refrigerant pump includes a thin-walled hermetic vessel and a thick-walled hermetic vessel having an end inserted into and secured to an end of the thin-walled hermetic vessel. A stator of an electric motor unit is fitted outside the thin-walled hermetic vessel, while a rotor of the electric motor unit is accommodated inside the thin-walled hermetic vessel. A pump mechanism is fitted inside the thick-walled hermetic vessel, and a rotational force of the rotor is transmitted to the pump mechanism by the drive shaft.

Refrigerant pump with rotors in bearing

A semiconductor cooling device includes a cold plate for cooling a semiconductor element, a condenser, and an inverter-controlled refrigerant pump, all of which are fluid connected in series with each other to define a refrigerating cycle. The semiconductor cooling device also includes a fan for cooling the condenser, a temperature detector disposed in proximity to the semiconductor element, and a controller for controlling the refrigerant pump and the fan. The controller controls the number of revolutions of the refrigerant pump and that of the fan depending on a value measured by the temperature detector.

Semiconductor cooling device

A semiconductor cooling device includes at least one cold plate for cooling a semiconductor element, a condenser adapted to be cooled by a fan, and a refrigerant pump. The refrigerant pump is electrically connected to an inverter controller that controls the number of revolutions of the refrigerant pump.

Semiconductor cooling device and method of controlling same

A cooling device for cooling a semiconductor element includes at least one cold plate utilizing a copper plate for cooling a semiconductor element, a condenser utilizing a plurality of flat micro-tubes, a refrigerant pump for circulating a refrigerant, and a fan for cooling the condenser. The cold plate, the condenser, and the refrigerant pump are fluid connected to define a refrigerant circulating circuit.

Growing community of inventors

Shiga, Japan

Masao Nakano