Ngk Spark Plug Company, Limited

Masao Kuroda

Hajime Saiki

Shinji Yuri

Yukihiro Kimura

Ryuji Imai

Yasuhiro Sugimoto

Makoto Origuchi

Nobuhiko Miyawaki

Tadahiko Kawabe

Toshiya Asano

Susumu Wakamatsu

Sotaro Tsukamoto

A wiring board having an excellent electrical property and reliability or the like. The wiring board includes a core board, a capacitor and a resin filler. The core board includes an accommodation hole therein and a core board main surface side conductor disposed on the core main surface thereof. A capacitor main surface side electrode is disposed on a capacitor main surface of the capacitor. A gap between the capacitor accommodated in the accommodation hole and the core board is filled with the resin filler so that the capacitor is fixed to the core board. Further, the resin filler has a main surface side wiring forming portion on which a main surface side connecting conductor, which is connected to an end portion of a via conductor, is disposed so as to connect the core board main surface side conductor to the capacitor main surface side electrode.

Wiring board

A method for manufacturing a wiring board which can simplify a manufacturing step. In a preparation step, a core board and an electronic component are prepared. In an insulating layer formation and fixing step, after accommodating the electronic component in an accommodation hole, a lowermost resin insulating layer is formed, and a gap between the electronic component and the core board is filled with a part of the lowermost resin insulating layer so as to fix the electronic component to the core board. In an opening portion formation step, a portion of the lowermost resin insulating layer located directly above the gap between the electronic component and the core board is removed so as to form an opening portion exposing a part of a core board main surface side conductor and a component main surface side electrode. In a main surface side connecting conductor formation step, a main surface side connecting conductor is formed in the opening portion so as to connect the core board main surface side conductor to the component main surface side electrode.

Method for manufacturing wiring board

In a multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, the grounding conductor wiring is in the form of a grid and an open area ratio Rx [%]of the grid and a line width ratio Ry=Wg/Ws have a relationship expressed by Ry, .ltoreq.25.98.times.Rx.sup.-0.3871 -4.370 where Wg is the line width of the grounding conductor wiring, Sg is the width of an opening of the grid, Ws is the line width of the signal circuit wiring, and Rx={Sg/(Wg+Sg)}.sup.2 .times.100.

Multi-layer wiring board

An object of the present invention is to match impedance of each portion of whole lines of a signal wiring with the integrated circuit mounted on the package. All ground planes are deleted within a region vertically under/above a connection pad provided on the top- or bottom-surface of a polyimide multilayer part, whereby no capacitance is generated between the connection pad and the ground planes, so that the impedance of the signal wiring within the region right under/above the connection pad is prevented from being lowered.

Integrated circuit package in which impendance between signal pads and

An object to the present invention is to provide an integrated-circuit package in which crosstalk can be reduced and impedance matching can be made. According to the present invention, conductive poles are grid-like arranged equidistantly in rows respectively in the vertical and transversal directions of an insulating substrate. The conductive poles are classified into signal conductive poles which are electrically connected to electrodes of the integrated circuit and the mother board, and earthed ground conductive poles arranged so as to adjacently surround the signal conductive poles.

Integrated-circuit package

The present integrated circuit package provides both a high density of conductor poles, and reduced crosstalk noises between the conductor poles. The conductor poles are received within holes in an insulating substrate. The insulating substrate has a laminated, multi-layer ceramic substrate structure comprising insulating plates having metallized layers thereon which constitute a portion of the walls of the holes. In addition, insulating layers for insulating the metallized layers from the conductor poles are formed within a selected number of the holes.

Integrated circuit package

The present integrated circuit package provides both a high density of conductor poles, and reduced crosstalk noise between the conductor poles. The conductor poles are arranged within a selected number of holes in an insulating substrate. Metallized layers for shielding the conductor poles are provided on the walls of the holes in the insulating substrate which receive the conductor poles. In addition, an insulating layer is provided on the inner circumferences of the metallized layers, which insulating layers directly surround the conductor poles to preclude direct contact between the conductor poles and the metallized layers.

Growing community of inventors

Aichi, Japan

Masao Kuroda