Kabushiki Kaisha Toshiba

Masao Kudou

Natsuki Kushiyama

Tatsuo Ikawa

A semiconductor IC device includes a pad, an input receiver, an input receiver control circuit, an output driver, an output driver control circuit, an input control clock signal line, a reference potential line, an output control clock signal line, a first power supply line, and a second power supply line. The input receiver, the input receiver control circuit, the output driver control circuit, the input control clock signal line, the reference potential line, the output control clock signal line, and the first power supply line are arranged on one side of the pad, while the output driver and the second power supply line are arranged on the other side of the pad.

Semiconductor integrated circuit device and semiconductor device system

There is disclosed a semiconductor integrated circuit device comprising: at least two first power supply voltage leads provided outside a chip adapted to be supplied with a first power supply voltage, e.g., VSS and a second power supply voltage, e.g., VCC and supplied with said first power supply voltage; at least two first power supply voltage terminals provided inside the chip, and connected to respective different ones of the first power supply voltage leads; an external input circuit adapted so that a signal is inputted from the outside of the chip, and connected to at least any one of first power supply voltage terminals; and an internal circuit adapted so that the signal is inputted from the external input circuit, and connected to one which is not connected to the external input circuit of the first power supply voltage terminals. Further, this semiconductor integrated circuit device may further comprise at least two second power supply voltage terminals provided inside the chip, and connected to respective different ones of the second power supply leads.

Growing community of inventors

Yokohama, Japan

Masao Kudou