Nippon Steel Corporation

Nippon Steel Chemical Co., Ltd.

Texas Instruments Corporation

Unitika Ltd.

Masao Kimura

Munetsugu Matsuo

Naoya Masahashi

Toshihiro Hanamura

Masanao Kawabe

Hideki Fujii

Toshihiro Yamamoto

Youji Mizuhara

Hiroshi Ohishi

Ikuro Yamaoka

Hiroo Suzuki

Shinji Inaba

Keizo Hashimoto

Hiroyuki Kondo

Kazuhiro Sugiyama

Kenichi Miyazawa

Kohei Tatsumi

Toshiaki Mizoguchi

Keiichi Saito

Takumi Tanaka

Koichi Fujishiro

Hiroharu Inoue

Souichiro Kishimoto

Keizo Kyuda

Akio Motoyama

Takamasa Owaki

Kiyoshi Onodera

A resin-coated, bonding fine wire for use in forming bonded electrical connections on a semiconductor device, wherein the bonding wire comprises an elongated fine wire of electrically conductive material, and first and second non-conductive coating layers. The first non-conductive coating layer covers the elongated fine wire and is of a material having good insulating property and heat resistance. The second non-conducting coating layer covers the first non-conductive coating layer and is of a material having good abrasion resistance. The first non-conductive coating layer includes at least one aromatic polyester resins, and the second non-conductive coating layer includes at least one resin selected from the group consisting of polyurethanes, polyester imides and polyimides. The second non-conductive coating layer is built up from a plurality of successive coats to define the second non-conductive coating layer as a non-conductive multilayer coating structure.

Bonding wire with heat and abrasion resistant coating layers

Resin coated bonding wire, method of manufacturing the same, and

This invention relates to TiAl based intermetallic compound alloy and process for producing; the object of this invention is to improve high temperature deformability. The alloy comprises basic components: Ti.sub.y AlCr.sub.x, wherein 1%.ltoreq.X.ltoreq.5%, 47.5%.ltoreq.Y.ltoreq.52%, and X+2Y.gtoreq.100%, and comprises a fine-grain structure with a .beta. phase precipitated on a grain boundary of equiaxed .gamma. grain having grain size of less than 30 .mu.m, and possessing a superplasticity such that the strain rate sensitivity factors (m value) is 0.40 or more and tensile elongation is 400% or more tested at 1200.degree. C. and a strain rate of 5.times.10.sup.-4 S.sup.-1.

Process for producing .gamma. and .beta. dual phase TiAl based

A process is disclosed for preparing of aromatic polyester-polystyrene block copolymers which comprises subjecting preferentially styrene polymers (A) having terminal functional groups reactive with acid chloride groups and an excess of aromatic dicarboxylic acid dihalides (C) to condensation and then subjecting continuously the resultant mixture and aromatic dihydroxy compounds (B) to interfacial polymerization at the ratio (A)/[(B)+(C)] by weight of 5/95 to 80/20, without separating reaction products of styrene polymers (A) and aromatic dicarboxylic acid dihalides (C), and the block copolymers thus prepared contain a small amount of uncopolymerized styrene polymers, have long aromatic polyester segments, show low birefringence, good transparency, exceptionally low birefringence, low melt viscosity, and good mechanical strength, and are particularly useful as materials for optical instruments.

Process for preparing aromatic polyester-polystyrene block copolymers

A process is disclosed for the preparation of aromatic polyester-polystyrene block copolymers by solution polycondensation of styrene polymers (A) having terminal functional groups reactive with acid halide or hydroxyl groups, aromatic dihydroxy compounds (B), and aromatic dicarboxylic acid dihalides (C) at (A)/[(B)+(C)] (by weight) of 5/95 to 80/20 and the polymers are suitable as molding materials for optical instruments for their good transparency, particularly low birefringence, low melt viscosity, and good mechanical strength.

Ti-A1 intermetallic compound sheet and method of producing same

Heat-resistant resin compositions with an excellent pearly luster of this invention consist essentially of polycarbonates prepared from bisphenol A or its derivatives of the following general formula (I) ##STR1## in which R is hydrogen, a halogen, or a lower alkyl group and methyl methacrylate-.alpha.-methylstyrene copolymers with a weight average molecular weight of 30,000 to 200,000 and are useful for molding industrial articles requiring heat resistance.

Heat-resistant resin compositions with a pearly luster

This invention relates to TiAl based intermetallic compound alloy and process for producing; the object of this invention is to improve high temperature deformability. The alloy comprises basic components: Ti.sub.y AlCr.sub.x, wherein 1%.ltoreq.X.ltoreq.5%, 47.5%.ltoreq.Y.ltoreq.52%, and X+ 2Y.gtoreq.100%, and comprises a fine-grain structure with a .beta. phase precipitated on a grain boundary of equiaxed .gamma. grain having grain size of less than 30 .mu.m, and possessing a superplasticity such that the strain rate sensitivity factors (m value) is 0.40 or more and tensile elongation is 400% or more tested at 1200.degree. C. and a strain rate of 5.times.10.sup.-4 S.sup.-1.

.gamma. and .beta. dual phase TiAl based intermetallic compound alloy

Molding materials of this invention comprise copolymers consisting essentially of 10 to 30% by weight of .alpha.-methylstryene units. 40 to 70% by weight of methyl methacrylate and 10 to 30% by weight of stryene units with a weight average molecular weight in the range from 50,000 to 200,000, a melt flow rate (MFR) in the range from 4 to 18 g./10 min. at 220.degree. C. under a 10-kg load, and a Vicat softening point of 130.degree. C. or more, show a high degree of transparency, good heat and weather resistance and good moldability and are best suited for such uses as automotive and electrical parts.

Molding materials

A method of injection molding a styrene resin or a composition thereof, which includes injection molding a molten molding resin material of a styrene-conjugated diene block copolymer containing 50 to 90% by weight of a styrene polymer or a molten molding resin material of a resin composition comprising 50% by weight or more of the styrene-conjugated diene block copolymer and 50% by weight or less of a styrene resin other than the styrene-conjugated diene block copolymer, wherein the molten resin is injected and filled into a mold with a wall surface temperature at core and cavity portions within the mold being made 110.degree. to 180.degree. C., and the molded product is demolded when the wall surface temperature of the core and cavity portions is lowered to the glass transition temperature or lower of the styrene polymer moiety in the block copolymer. The obtained molded product has a high impact resistance.

Injection molding of styrene resin

An aromatic polyester carbonate comprising structural units represented by the following formulae (A), (B), (C), and (D) and satisfying the following relationship when the mole fractions of the structural units represented by the formulae (A), (B), (C), and (D) are defined as a, b, c, and d, respectively: ##EQU1## and having an inherent viscosity [.eta..sub.inh ] in a solution at a concentration of 0.5 g/dl in p-chlorophenol as a solvent at 50.degree. C. of 1.0 dl/g or higher, or being insoluble in the solvent, and having liquid crystal properties ##STR1## wherein R is the same or different and represent an alkyl, phenyl group or a halogen, and n represents an integer of 0 to 4; ##STR2## X.sup.1 represents a substituted or non-substituted phenyl group, an alkyl group having 3 to 6 carbon atoms or a halogen;

Aromatic polyester carbonate from diphenol mixture

Growing community of inventors

Kawasaki, Japan

Masao Kimura