Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Masao Kanari

Junichi Sawanobori

Chunfu Chen

Daoqiang Lu

Chao Wang

Bin Li

Shuichi Iwasaki

Daniel Lu

This invention relates to an epoxy based composition, comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one curing catalyst. The epoxy based composition according to the present invention exhibits fast curing property under UV light and has improved adhesion strength after being further heated.

Epoxy based composition

The present application relates to a resin composition and in particular to a light-curable resin composition. It is known to achieve a thixotropic behavior of an adhesive composition by adding an inorganic additive like fumed silica. Adding inorganic additives results in significant particle problems as fumed silica is a solid particle and affects the optical performance of the adhesive composition. In accordance with the invention a particle free resin composition with a thixotropic behavior is provided. The inventive composition comprises a) 30 to 90 wt % of a urethane acrylate oligomer with a molecular weight greater than 15000, b) 2 to 40 wt % of a (meth)acrylate monomer having a benzene ring, and c) 0.2 to 10 wt % of a photo initiator.

Light curable resin composition

A liquid photo-curable adhesive composition comprising:

Liquid optically clear photo-curable adhesive

A process for binding a top substrate to a base substrate is disclosed, in which

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Kawasaki, Japan

Masao Kanari