Toray Industries, Inc.

Masao Kamogawa

Mitsuhito Suwa

Toru Okazawa

Hiroko Mitsui

Eisuke Iizuka

Michiko Yamaguchi

Keiichi Uchida

Chika Taniguchi

Yumiko Okuda

Miki Nakamichi

Masayuki Naruto

Disclosed is a polymetalloxane including a constituent unit represented by the following general formula (1), which stably exists in a transparent and uniform state in a solution and can form a homogeneous cured film: wherein Ris an organic group and at least one of Ris an (RSiO&#x2014;) group, Ris optionally selected from specific groups, Ris optionally selected from specific groups, when plural R, R, and Rexist, they may be the same or different, M represents a specific metal atom, m is an integer indicating a valence of a metal atom M, and a is an integer of 1 to (m&#x2212;2).

Polymetalloxane, method for producing same, composition thereof, cured film and method for producing same, and members and electronic components provided with same

Provided is a siloxane resin composition having excellent adhesion and fine patterning properties. The siloxane resin composition contains: a siloxane resin (A) including a structure represented by general formula (1), a structure represented by general formula (2), and a structure represented by general formula (3); a compound (B) having an unsaturated double bond; a photopolymerization initiator (C); and a solvent (D).

Siloxane resin composition, adhesive using same, display device, semiconductor device, and illumination device

A positive photosensitive resin composition including: a polysiloxane synthesized by hydrolyzing and partially condensing a specific organosilane and an organosilane that has a carboxyl group and/or a dicarboxylic acid anhydride structure; particles of one or more metal compounds selected from an aluminum compound, a tin compound, a titanium compound, and a zirconium compound, or composite particles of a silicon compound and one or more metal compounds selected from an aluminum compound, a tin compound, a titanium compound, and a zirconium compound; a naphthoquinone diazide compound; and a solvent.

Positive photosensitive resin composition, cured film formed by curing same, and optical device equipped with same

A photosensitive resin composition which can impart insulating properties and light-shielding properties against light having a wavelength lying in an ultra-violet range, a visible range and a near-infrared range to a substrate more readily when applied onto the substrate, wherein the substrate has such properties that the permeability to light having a wavelength of 400 to 900 nm inclusive is less than 3.0% and the maximum value of the permeability to light having a wavelength of longer than 900 nm and not longer than 1300 nm is 3.0% or more. The photosensitive resin composition is characterized by comprising (a) an alkali soluble resin, (b) a specific tungsten oxide and/or a specific composite tungsten oxide, (c) a photopolymerizable compound having at least two polymerizable groups, (d) an oxime-type photopolymerization initiator, and (e) a solvent.

Photosensitive resin composition, laminate utilizing same and solid-state imaging device

Disclosed is a positive photosensitive resin composition which is characterized by containing (a) a polysiloxane that is synthesized by hydrolyzing and partially condensing a specific organosilane and an organosilane oligomer, (b) aluminum compound particles, tin compound particles, titanium compound particles, zirconium compound particles, composite particles of the aforementioned compounds or composite particles of any of the aforementioned compounds and a silicon compound, (c) a naphthoquinonediazide compound and (d) a solvent. The positive photosensitive resin composition is also characterized in that the organosilane oligomer contains a specific organosilane. The positive photosensitive resin composition has achieved excellent sensitivity and resolution without deteriorating high refractive index and high transparency.

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Otsu, Japan

Masao Kamogawa