Canon Kabushiki Kaisha

Masao Ina

Masato Ofuji

Katsuro Takenaka

Takamasa Ishii

Tamaki Kobayashi

Tomoyuki Oike

Yoshito Sasaki

A manufacturing method of a radiation imaging apparatus in which a sensor substrate and a scintillator are bonded by a bonding member, is provided. The method includes: forming, on a support substrate, a functional layer including a moisture preventing layer configured to suppress permeation of water; forming the scintillator on the support substrate with the functional layer arranged thereon; and separating, from the support substrate, at least a part of the scintillator together with the functional layer.

Manufacturing method of radiation imaging apparatus

A method of operating a radiation imaging apparatus including a sensor substrate which includes a plurality of pixels arranged in a matrix, each pixel including a conversion element configured to convert radiation or light into an electric charge and accumulate the electric charge and a switch element. The method includes, supplying a first driving potential to set the switch element in a non-conductive state, changing a bias potential supplied to a second terminal of the conversion element to remain a charge in the conversion element, supplying a second driving potential to the switch element to readout a remaining charge, and calculating a threshold voltage of the switch element based on the remaining charge.

Operation method of radiation imaging apparatus having sensor substrate and bias power supply, radiation imaging apparatus, and computer-readable medium

A sensor board comprising a substrate comprising a pixel region where pixels are arranged on a first surface of two surfaces, a scintillator arranged on one of the first surface and a second surface of the two surfaces and a light shielding member arranged on the surface on which the scintillator is arranged, is provided. The pixel region comprises a first region where a signal for radiation image is generated and a second region where a signal for correcting a signal output from the first region is generated. The scintillator is arranged to overlap the first region but not to overlap the second region. The light shielding member is arranged to cover the scintillator and overlap the second region. A portion of the light shielding member overlapping the second region is bonded to the surface on which the scintillator is arranged.

Growing community of inventors

Kanagawa, Japan

Masao Ina