Tohto Kasei Co., Ltd.

Other

Nitto-denko Corporation

Matsushita Electric Works, Ltd.

Nippon Steel Chemical Co., Ltd.

Masao Gunji

Chiaki Asano

Hiroshi Sato

Takashi Sagara

Toshiharu Takata

Kiyoaki Ihara

Hidetaka Kakiuchi

Kazuo Ishihara

Takashi Taniguchi

Hisataka Ito

Kazuhiro Fuke

Shinya Ota

Chisato Goto

Kazuhiko Yoshida

Seigou Takuwa

The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C): in which n is a positive number,

Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same

A novel flame-retardant thermoplastic polyhydroxy polyether resin obtained by reacting at least one epoxy resin (A) selected from glycidyl esters of divalent aliphatic carboxylic acids having 15 to 64 carbon atoms or glycidyl ethers of divalent aliphatic alcohols having 15 to 64 carbon atoms with a phosphorus atom-containing divalent phenol compound (B) as essential components, wherein the component (A) accounts for 2 to 52 mol % with respect to the whole resin, the weight average molecular weight thereof is 10,000 to 200,000, and the phosphorus content thereof is 1 to 5 wt %.

Thermoplastic polyhydroxy polyether resin and resin composition comprising the same

The present invention features phosphorus containing epoxy resin compositions useful for imparting flame retardant properties to prepregs, resin-clad metal foils, and laminate boards constructed therefrom. The phosphorus containing epoxy resin composition (a) comprises a phosphorus containing epoxy resin (A) and a hardener. The phosphorus containing epoxy resin (A) has an epoxy equivalent of 300-500 g/eq. and comprises the reaction product of a phosphorus containing organic compound (B) and at least one epoxy resin (C). Phosphorus containing compound (B) is the reaction product of organic phosphorus compounds (b) having one active hydrogen atom bonded to a phosphorus atom and a quinone compound, wherein the molar ratio of (b) to quinone is from 1.25:1 to 2:1. This molar excess of (b) yields a phosphorus containing compound (B) that comprises both the reaction product of (b) and quinone, as well as un-reacted (b). Epoxy resin (C) is selected from a group of specific aromatic-containing epoxy resins, and the content of epoxy resin (C) comprises from 20 to 45 wt. % of (A).

Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board

Thermoplastic polyhydroxypolyether resin and an insulation film produced therefrom

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Sodegaura, Japan

Masao Gunji