Canon Kabushiki Kaisha

Masao Furukawa

Seiichi Kamiya

Takashi Mori

Nobuhito Yamaguchi

Yuji Tsuruoka

Takayuki Ono

Masashi Ishikawa

Akira Goto

Takeshi Shibata

Ryo Shimamura

Shin Ishimatsu

Toshinori Hasegawa

Jun Hinami

Masaki Inaba

Shimpei Otaka

Tomohiro Takahashi

Takanori Enomoto

Akio Saito

Miki Ito

Akira Yamamoto

Kazuhiro Yamada

Yasuo Kotaki

Tsutomu Abe

Seiichiro Karita

Yoshiyuki Nakagawa

Shingo Okushima

Ken Tsuchii

Shuzo Iwanaga

Masataka Sakurai

Noriyasu Nagai

Takatsuna Aoki

Ken Ikegame

Yasuto Kodera

Akiko Saito

Zentaro Tamenaga

Kouichi Omata

Tatsurou Mori

Yusuke Imahashi

Akira Shibasaki

Kazuhiro Jindai

Miki Itoh

Hirofumi Ota

Yu Katano

Asuka Horie

Akio Saitoh

The object is to provide a liquid container that can prevent foreign substances from flowing into a liquid ejection apparatus with a simple configuration. The liquid container for containing liquid to be ejected by a liquid ejection apparatus includes: a bag body configured to contain the liquid inside; and a flow path for supplying the liquid contained inside the bag body to the liquid ejection apparatus, wherein, inside a peripheral wall of the flow path, a first capturing unit extending in an anti-gravitational direction and a second capturing unit extending in a gravitational direction are arranged at different positions with respect to a direction in which the liquid flows.

Liquid container

A liquid ejection head has a plurality of ejection modules having a recording element substrate equipped with a plurality of ejection orifices for ejecting a liquid, a plurality of first flow path members that supports at least one of the ejection modules and a second flow path member provided in common with the first flow path members and supporting the first flow path members. The first flow path members and the second flow path member are equipped with a flow path for supplying a plurality of recording element substrates with a liquid. The first flow path members are joined with the second flow path member via an adhesive layer without being brought into direct contact with the second flow path member.

Liquid ejection head, liquid ejection apparatus and method of manufacturing liquid ejection head

The present invention relates the method of manufacturing a liquid discharge head, in which a plurality of element substrates are adjacently arranged in a predetermined direction on a support plate by using a UV adhesive. The method for manufacturing a liquid ejection head is capable of reducing variations in the positions of element substrates while avoiding an increase of a tact time.

Method for manufacturing liquid ejection head

A method of manufacturing a liquid discharge head in which a device substrate having an energy generating element and a supply port and a supporting member having a supply passage are bonded with each other an adhesive agent includes:

Method of manufacturing liquid discharge head

An electric connection method for connection between a semiconductor substrate and an electric wiring substrate includes a first process for providing the semiconductor substrate having a heating member and a pad and the electric wiring substrate having first wiring and second wiring, a second process for electrically connecting the first wiring and the heating member, a third process for causing the heating member to generate heat by supplying power to the heating member through the first wiring, and a fourth process for electrically connecting the pad and the second wiring at a temperature higher than a temperature for electrically connecting the first wiring and the heating member.

Electric connection method

There is provided a liquid ejection head that can reduce trouble in alignment of a print element substrate even in the case where a high magnification optical system is used and a method for fabricating the liquid ejection head. To achieve this, an auxiliary mark that indicates a relative position with respect to a reference mark is detected and recognized, and thus the position of the reference mark is identified even in the case where the reference mark is not reflected in a camera.

Liquid ejection head and method for fabricating the same

There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths.

Method of manufacturing liquid ejection head, and liquid ejection head

There is provided a method for manufacturing an ink jet recording head in which a plurality of recording element substrates used for discharging ink are appropriately arranged onto a support substrate.

Method for manufacturing ink jet recording head

A liquid recording head includes a protective layer having resistance to liquid and an adhesiveness improving film disposed on a second surface of a silicon substrate, opposite to a first surface. The first surface and the second surface have a plane direction (100). The protective layer is disposed in a peripheral region of an opening of a liquid supply port. A liquid ejection chip is bonded to a head substrate with an adhesive so that the liquid supply port communicates with a liquid introduction port on a side of the second surface of the silicon substrate.

Liquid recording head and method of manufacturing the same

A method of manufacturing a liquid ejection head includes: defining a first imaginary reference line along the longitudinal direction of a base member and measuring the distances between the first imaginary reference line and at least two liquid supply port portions of a liquid supply port row, including defining a second imaginary reference line passing the liquid supply port portion at the shortest distance from the first imaginary reference line and the liquid supply port portion at the longest distance from the first imaginary reference line respectively from among the at least two liquid supply port portions and defining the second imaginary reference line between two imaginary lines parallel to the first imaginary reference line.

Method of manufacturing liquid ejection head and liquid ejection head

A liquid jet recording head includes a substrate including a plurality of discharge energy generating elements, and a plurality of ink supply ports positioned along an array direction of the plurality of discharge energy generating elements and separated from each other by beams, a plurality of ribs supported by the beams, and an orifice plate supported by the plurality of ribs, wherein the orifice plate includes discharge ports for discharging liquid droplets which enter from the plurality of ink supply ports and is provided with discharge energy by the plurality of discharge energy generating elements.

Inkjet recording head

The present invention provides liquid ejection head enables a reduction in the distance between a print medium and an ejection port formation face of the liquid ejection head on which an ejection port is formed, improving the landing accuracy of droplets ejected from the liquid ejection head. A print head according to the present invention includes an element substrate and a supporting member. A supporting portion is located in the space between the element substrate and the supporting member. Connection wiring is formed on the supporting portion. The connection wiring is provided which connects wiring inside of the supporting member provided in the supporting member to the heat generating element.

Liquid ejection head and method for manufacturing liquid ejection head

A circuit pattern forming method that can reduce a possibility of undesired short-circuits being produced in the circuit by satellites formed when fabricating a conductive pattern. Thereby, a highly reliable printed circuit board can be formed. A conductive pattern and an insulating pattern of a predetermined thickness are overlappingly drawn by scanning a liquid ejection head and a substrate relative to each other a plurality of times, while ejecting droplets of a conductive pattern forming solution and an insulating pattern forming solution. When forming the conductive pattern and the insulating pattern that adjoin each other on the substrate, the step of forming the insulating pattern of at least one scan is executed between the conductive pattern forming steps that are executed the plurality of times, until the conductive pattern has a predetermined thickness.

Circuit pattern forming method, circuit pattern forming device and printed circuit board

A plurality of conductive patterns are formed so as to be arranged in a scanning direction of a recording head. A state of each of the conductive patterns and a state between the adjacent conductive patterns are electrically checked to detect a wire break and a short circuit in the conductive patterns.

Pattern forming method and pattern forming apparatus

An object of the present invention is to provide a wiring module that enables dense mounting and a reduction in wiring distance. The wiring module in accordance with the present invention includes a base material, a plurality of electronic circuit parts, insulating portions, and conductive portions connected to the electronic circuit parts, the plurality of electronic circuit parts, the insulating portions, and the conductive portions being integrally held on the base material. Wires are composed of a stack of the conductive portions and extend in a direction crossing a surface of the base material and in a direction crossing a direction perpendicular to the base material surface to electrically connect the plurality of electronic circuit parts together.

Wiring module

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Yokohama, Japan

Masao Furukawa