Momentive Performance Materials Japan LLC

Momentive Performance Materials Gmbh

Toshiba Silicone Co., Ltd.

Masanori Takanashi

Daigo Hirakawa

Isao Iida

Kenji Takenaka

Eiji Tanigawa

Hideki Kobayashi

Anubhav Saxena

Makoto Matsumoto

Sandeep Naik

Pranabesh Dutta

Vinu Krishnan Appukuttan

Koji Miyata

Atsushi Sakamoto

Ramasubramanian Narayanan

Koki Otashiro

Mandal Subrata

A curable silicone adhesive composition comprising a combination of adhesion promoters is shown and described herein. The composition includes a first adhesion promoter selected from a silicon hydride adhesion promoter and a second adhesion promoter selected from an acrylate functional adhesion promoter to provide a silicone material that is curable at relatively low temperatures and shorter time and provides good adhesion to plastics and metal.

Addition curable silicone adhesive compositions

An adhesive polyorganosiloxane composition includes: (A) a polyorganosiloxane having 2 or more alkenyl groups in each molecule thereof; (B) a polyorganohydrodienesiloxane having 3 or more hydrogen atoms bonded to a silicon atom in each molecule thereof; (C) a platinum-based catalyst; (D) at least two kinds of adhesion-imparting agents selected from the group consisting of specific organic silicon compounds, silane compounds, tetraalkoxysilane compounds, and/or partial hydrolysis condensates thereof; (E) hexamethyldisilazane; (F) water; and (G) at least one of (G1) and (G2), where (G1) is a non-surface-treated inorganic filler having a BET specific surface area of 50 to 500 m/g, and (G2) is an inorganic filler obtained by surface-treating said (G1) with hexamethyldisilazane.

Adhesive polyorganosiloxane composition

An addition reaction curing type polyorganosiloxane composition for bonding poly(phenylene sulfide) resins includes (A) a polyorganosiloxane containing two or more alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having, in the molecule, three or more silicon-atom-bonded hydrogen atoms, (C) a platinum-based catalyst, (D) an oxide or carbonate of a metal selected from among the metals in Groups 2 and 12 of the periodic table, and (E) an adhesion promoter, the content of the ingredient (D) being 0.1-20 wt % with respect to the whole composition.

Polyorganosiloxane composition for use in adhesion of a polyphenylene sulfide resin

An adhesive polyorganosiloxane composition includes, at a specific composition ratio: (A) a linear polyorganosiloxane containing an alkenyl group including a low-viscosity linear polyorganosiloxane containing an alkenyl group; (B) a polyorganosiloxane containing at least three alkenyl groups in the molecule; (C1) a polyorganohydrogensiloxane having 3 or more hydrogen atoms bonded to a silicon atom in the molecule; (C2) a linear polyorganohydrogensiloxane having one hydrogen atom bonded to a silicon atom only at both terminals of the molecular chain, and having no aliphatic unsaturated bonds in the molecule; (D) a filler; (E) a platinum group metal compound; and (F) two or more kinds of specific adhesion imparting agent.

A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure.

Thermally conductive polyorganosiloxane composition

A siloxane compound represented by the general formula (1): where Ris a group having an alkoxysilyl group having 1 to 4 carbon atoms, Ris a linear organosiloxy group represented by the general formula (2): where each Ris independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each Ris independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

Surface treatment agent for thermally conductive polyorganosiloxane composition

A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.

Method for producing a thermally conductive polysiloxane composition

The present invention relates to a thermally conductive polysiloxane composition that provides a cured product having excellent tackiness and flexibility in which the composition contains (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure, (C) a polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule, (D1) a linear polyorganohydrogensiloxane represented by the general formula (4), (D2) a polyorganohydrogensiloxane having per molecule at least three units represented by the general formula (5), and (E) a platinum catalyst.

A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 &#x3bc;m to 150 &#x3bc;m in an amount of at least 20% by mass, based on the mass of a total of the component (A).

Thermally conductive polysiloxane composition

Silicone polymer and composition comprising the same

A thermally conductive composition is a thermally conductive composition including (A) a spherical thermally conductive filler, (B) an alkoxysilane compound or dimethylpolysiloxane, and (C) a polyorganosiloxane (not inclusive of the dimethylpolysiloxane of component (B)), wherein component (A) is a mixture formulated with specific ratios of fillers having different average particle sizes, the mixture being formulated with a filler having an average particle size of 50 &#x3bc;m or more in an amount of 30% by mass or more; component (B) and component (C) are included in a total amount of 1.5 to 35 parts by mass relative to 100 parts by mass of component (A); and a content ratio of component (C) in the total amount of component (B) and component (C) is 15 to 98% by mass.

Thermally conductive composition

A thermally conductive silicone composition is shown and described herein. The thermally conductive silicone composition comprises (A) an ionically modified siloxane, and (B) a thermally conductive filler comprising a first filler and a second filler, where the first filler and/or the second filler comprises a plurality of filler types, the plurality of filler types differing from one another in terms of particle size and/or morphology. The ionically modified siloxane may function as a dispersing aid or wetter for efficient dispersion of thermal conducting organic and inorganic fillers to achieve high thermal conductivity.

Thermal interface composition comprising ionically modified siloxane

A method of preparing a curable polyorganosiloxane composition including kneading a uniform mixture of an alkenyl group-containing polyorganosiloxane, a polyorganohydrogensiloxane, and a platinum group metal compound, and defoaming the kneaded mixture under reduced pressure, the alkenyl group-containing polyorganosiloxane includes a linear polyorganosiloxane of the formula (I): R is Ror R, and at least two Rs are R; Ris C-Calkenyl; Ris C-Calkyl; and n is a value that yields a viscosity at 23&#xb0; C. of 10 to 10,000 cPs, a branched polyorganosiloxane containing SiOand R'SiOunits, optionally a R&#x2032;SiO and/or a R&#x2032;SiO, R&#x2032; represents a monovalent aliphatic or alicyclic, and at least three R&#x2032; groups per molecule are alkenyls, the alkenyl group-containing polyorganosiloxane having a weight ratio of the branched to linear polyorganosiloxane of 1 to 5; and a number of hydrogens bonded to a silicon atom of the polyorganohydrogensiloxane exceeds 2.

Method of preparing a curable polyorganosiloxane composition

A curable polyorganosiloxane composition for use in an LED or optical lens, including: (A) an alkenyl group-containing polyorganosiloxane which contains a (A1) branched polyorganosiloxane including an SiOunit and an RSiOunit, and optionally an RSiO unit and/or an RSiOunit, wherein at least three R per molecule are vinyl groups, and optionally (A2) a linear polyorganosiloxane having R bonded to a silicon atom, wherein at least two R per molecule are vinyl groups, wherein 100 mol % or more of the R present in components (A1) and (A2), excluding alkenyl groups, are methyl groups; (B) a polyalkylhydrogensiloxane including an SiOunit and an R(CH)SiOunit, the polyalkylhydrogensiloxane having the formula [R(CH)SiO][SiO]or [R(CH)SiO][SiO], wherein each Rrepresents a hydrogen atom, and (C) a platinum-vinylsiloxane complex. The composition having desirable light transmission properties, and is unlikely to suffer yellowing due to exposure to heat.

Curable polyorganosiloxane composition

Provided is a curable polyorganosiloxane composition which advantageously forms a cured product suitable for LED or optical lens, wherein the cured product has excellent light transmission properties in a short wavelength region, i.e., in the blue to ultraviolet region and is unlikely to suffer yellowing due to exposure to heat. A curable polyorganosiloxane composition comprising: (A) alkenyl group-containing polyorganosiloxane which comprises (A1) branched polyorganosiloxane comprising an SiOunit and an RSiOunit, and optionally an RSiO unit and/or an RSiOunit (wherein each R independently represents an unsubstituted or substituted monovalent hydrocarbon group), wherein at least three R per molecule are alkenyl groups, and optionally (A2) linear polyorganosiloxane having R bonded to a silicon atom (wherein R is as defined above), wherein at least two R per molecule are alkenyl groups, wherein 90 mol % or more of the R present in components (A1) and (A2), excluding alkenyl groups, are methyl groups; (B) polyalkylhydrogensiloxane comprising an SiOunit and an R(CH)SiOunit (wherein each Rindependently represents a hydrogen atom or a methyl group), wherein at least three Rper molecule are hydrogen atoms; and (C) a platinum group metal compound.

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Tokyo, Japan

Masanori Takanashi