Ricoh Company, Ltd.

Tdk Corporation

Petroleum Energy Center

Other

Hamamatsu-Photonics K.k.

Screen Holdings Co., Ltd.

Hamanakodenso Co., Ltd.

Techno Ryowa Ltd.

Mitsubishi Chemical Corporation

Mitsumi Electric Company Ltd.

Ihi Corporation

Daiichi Pharmaceutical Co., Ltd.

Takemoto Yushi Kabushiki Kaisha

Techno Polymer Company Limited

Heraeus Tenevo Gmbh

Masanori Suzuki

Yohichiroh Watanabe

Keiko Shiraishi

Toyoshi Sawada

Takuya Saito

Kohki Katoh

Masahide Yamashita

Akihiro Kotsugai

Tsunemi Sugiyama

Hiroaki Matsuda

Hiroto Higuchi

Akemi Sugiyama

Tomonaga Nishikawa

Naoaki Fujii

Jin Konishi

Yoshitaka Ishii

Hiroshi Yamashita

Masami Tomita

Yasuaki Iwamoto

Mitsuo Aoki

Toshiki Nanya

Kazuhito Watanabe

Tomokatsu Sato

Hiroshi Yamada

Naohiro Watanabe

Shigeru Emoto

Shinichiro Yagi

Masashi Nagayama

Yuuichi Kawaguchi

Tadao Takigawa

Manabu Yamatani

Kazuaki Hirasawa

Hideki Okada

Hiroshi Nakai

Fumihiro Sasaki

Hiroyuki Fushimi

Akira Mizuno

Kumi Hasegawa

Masahiro Miyagi

Hiroyuki Araki

Akio Sugita

Nobuo Kawase

Takuya Takeuchi

Tetsuo Isoda

Tatsuhiko Osaki

Toshiyuki Kato

Satoshi Aratani

Toshihiko Hino

Tetsunori Inoguchi

Tomoe Hagiwara

Takahisa Kato

Yohichiro Watanabe

Haruyuki Togari

Hiroki Ogiso

Ikuya Kokubo

Atsuhi Shimada

Yutaka Watabe

Kouichi Okumura

Mituo Aoki

Makoto Watanabe

Yasushi Nakazato

Satoshi Muramatsu

Kazuyuki Shimada

Masahiro Nakajima

Tsukuru Kai

Yasuo Suzuki

Yasuo Asahina

Satoshi Mochizuki

Yusuke Takeda

Tomokazu Ito

Makoto Endo

Masahiro Nakano

Katsuhiro Hori

Takeshi Konno

Masayuki Ito

Tomio Kondou

Takeshi Takada

Takayuki Koike

Satoshi Komoriya

Hachiro Tosaka

Noriyasu Haginoya

Hatsuo Mori

Tsutomu Nagata

Yoshihiro Suguro

Kouji Kawamura

Hachiroh Tosaka

Yutaka Ishihara

Takayasu Nagahara

Toshiharu Yoshino

Syozo Kobayashi

Akiyoshi Mochizuki

Tadashi Nagahara

Nobuya Takahashi

Kohei Taya

Hiroshi Okafuji

Kazuki Iwai

Haruhiko Horino

Takeo Tsumuraya

Takahiro Nakamura

Tomoharu Oda

Provided is a coil component that includes a coil part having a planar coil that includes a winding section and an insulating section covering the winding section, and a magnetic resin layer including a magnetic filler and configured to cover the coil part. The magnetic resin layer has a first magnetic resin layer that is in contact with the coil part and a second magnetic resin layer that is laminated on the first magnetic resin layer. The second magnetic resin layer constitutes a principal surface of the magnetic resin layer, and a maximum particle size of the magnetic filler contained in the second magnetic resin layer is larger than that of the magnetic filler contained in the first magnetic resin layer.

Coil component and method of manufacturing the same

Disclosed herein is a coil component that includes: a magnetic element body containing magnetic powder, the magnetic element body having first and second surfaces; a coil conductor embedded in the magnetic element body; and an external terminal connected to the coil conductor and exposed on the first surface of the magnetic element body. The second surface of the magnetic element body is free from the external terminal. The first surface is greater in surface roughness than the second surface.

A coil component is provided with a coil part in which a plurality of conductor layers and a plurality of interlayer insulating layers are alternately laminated; and a sealing resin layer that covers the coil part. The conductor layers each include a spiral pattern. The interlayer insulating layers each cover an upper surface and a side surface of the spiral pattern. The recessed part is formed in the side wall surface of the interlayer insulating layer. A part of the sealing resin layer is embedded in the recessed part.

Coil component and manufacturing method therefor

A coil component includes: a first magnetic resin layer in a lower area; a second magnetic resin layer in an inner diameter area surrounded by a coil pattern, an outer peripheral area that surrounds the coil pattern, and an upper area; and an insulating gap layer between the first and second magnetic resin layers. A part of the insulating gap layer positioned between the first magnetic resin layer and a part of the second magnetic resin layer positioned in the inner diameter area is curved in the axial direction. A magnetic substrate need not be used. The insulating gap layer is provided, allowing the insulating gap layer to function as a magnetic gap. The insulating gap layer is curved in the axial direction, so that a contact area between the insulating gap layer and the first and second magnetic resin layers are increased to enhance adhesion therebetween.

Disclosed herein is an electronic component that includes: a base having a main surface; a passive element part formed on the main surface of the base; a magnetic resin layer formed on the main surface of the base so as to embed the passive element part therein, the magnetic resin layer having a surface extending substantially parallel to the main surface of the base; an insulating coat layer formed on a first area of the surface of the magnetic resin layer, the insulating coat layer having higher smoothness than the surface of the magnetic resin layer; and a terminal electrode formed on a second area of the surface of the magnetic resin layer and electrically connected to the passive element part.

Electronic component and manufacturing method thereof

A coil component includes a plurality of conductor layers constituted of a first conductor layer to a fourth conductor layer that includes a function layer and a coil layer wound around an axis center; and a covering portion that is formed of an insulative resin, integrally covers the plurality of conductor layers, and is interposed between conductor layers adjacent to each other. The coil layer and the function layer of the plurality of conductor layers have substantially the same shape in a plan view. The fourth conductor layer has a connection conductor layer connecting the coil layer and the function layer to each other. A conductor layer having no connection conductor layer among the plurality of conductor layers has a protrusion portion corresponding to the connection conductor layer at a position overlapping the connection conductor layer in a plan view.

Coil component

Disclosed herein is a coil component that includes: a coil part in which a plurality of conductor layers and a plurality of interlayer insulting layers are alternately laminated, the coil part having a mounting surface substantially parallel to the lamination direction and an upper surface substantially parallel to the lamination direction and positioned on an opposite side to the mounting surface; and a direction mark comprising a conductive material that covers a part of the conductor layers exposed on the upper surface.

Coil component and manufacturing methods thereof

In a coil component, in an upper coil portion, a winding end portion constituting an end portion is connected to a lead-out conductor. Accordingly, the lead-out conductor can absorb heat from the winding end portion and can dissipate heat to the outside via a terminal electrode. Moreover, the lead-out conductor is formed to cover a winding adjacent portion. Accordingly, heat can also be absorbed from the winding adjacent portion and can be dissipated to the outside via the terminal electrode. That is, in the coil component described above, since the lead-out conductor absorbs heat not only from the winding end portion but also from the winding adjacent portion, improvement of heat dissipation properties is realized in the coil component.

A pneumatically-actuated valve is provided in which a spring member that applies an axial force to a shaft connected to a valve body, in an axial direction of the shaft, and a valve-actuating pressure chamber that actuates the valve body by applying a force resisting the axial force to the shaft are provided inside a valve casing. The pneumatically-actuated valve includes an axial-force adjusting device that adjusts the magnitude of energy stored in the spring member, via a surface-pressure adjusting screw provided to be inserted through the valve casing, from the outside of the valve casing.

Pneumatically-actuated valve

A processing liquid supplying apparatus is arranged to discharge a processing liquid from a discharge port to supply the processing liquid to a processing object, and the processing liquid supplying apparatus includes a first piping, through the interior of which the processing liquid can flow, the interior of the first piping being in communication with the discharge port, and an X-ray irradiating means irradiating X-rays onto the processing liquid present inside the first piping. The first piping has an opening in its pipe wall and the opening is closed by a window member formed using a material that can transmit the X-rays, and the X-ray irradiating means irradiates the X-rays onto the processing liquid present inside the first piping via the window member.

Processing fluid supply device, substrate processing device, processing fluid supply method, substrate processing method, processing fluid processing device, and processing fluid processing method

A (meth)acrylic resin composition containing a (meth)acrylic polymer (P) and a phosphorus atom-containing compound (C), where the (meth)acrylic polymer (P) contains: (1) a repeating unit derived from methyl methacrylate at 19.95 to 84.95% by mass; (2) a repeating unit derived from a (meth)acrylic acid ester (M) having an aromatic hydrocarbon group or an alicyclic hydrocarbon group having from 3 to 20 carbon atoms in a side chain at 15.0 to 80.0% by mass; and (3) a repeating unit derived from a monomer (B) having two or more vinyl groups at 0.05 to 0.40% by mass, and an amount of the phosphorus atom-containing compound (C) with respect to 100 parts by mass of the (meth)acrylic polymer (P) being 5.0 to 35 parts by mass or less.

(Meth)acrylic resin composition and resin molded article

A connector adequately detects a state of an electronic component such as a memory card which is fitted in the connector by way of insertion, even when scrapes of a housing of the electronic component are produced due to insertion and removal of the electronic component which is fitted. In this connector (), detecting parts (A andB), which detect that a memory card () is fitted completely in an accommodating part () or detect whether or not data can be written in the memory card (), have fixed terminals () and movable terminals (). In the movable terminal (), a card contacting part () placed in the accommodating part () is pressed by the memory card (), so that a movable contact part () contacts and conducts with the fixed terminal (). An isolating wall part () is provided between the contacting part () and the movable contact part () to isolate a contact area between the movable contact part () and the fixed terminal (), from the contacting area between the contacting part () and the memory card ().

Connector

A toner composition including toner particles including a binder resin including a modified polyester resin, and a second resin having a weight average molecular weight of from 2,000 to 10,000; a colorant; a release agent; and a particulate material which is present at least a surface portion of the toner particles while embedded into the surface portion, wherein the binder resin has a glass transition temperature not lower than 35&#xb0; C. and lower than 55&#xb0; C., and wherein the particulate material has an average particle diameter of from 0.002 to 0.2 times that of the toner particles. A developer including the toner composition and a carrier having a layer thereon which includes at least an acrylic resin and a silicone resin, and a method for fixing an image of the toner composition are also provided.

Toner, developer including the toner, and method for fixing toner image

Growing community of inventors

Suntoh-gun, Japan

Masanori Suzuki