Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Everlight Electronics Co., Ltd.

Masanori Shimizu

Nobuyuki Matsui

Tetsushi Tamura

Tadashi Yano

Hideo Nagai

Tatsumi Setomoto

Kiyoshi Takahashi

Yoshinori Tanabe

Takeshi Arakawa

Yoshihisa Yamashita

Toshifumi Ogata

Kenji Mukai

Yoko Shimomura

Yoko Matsubayashi

Hiroshi Yagi

Syouetsu Sakamoto

Yoshio Manabe

Atsushi Motoya

Toshio Mori

Kazuaki Ohkubo

Yasuhiko Yamanaka

Kazuhiro Matsuo

Kenjiro Hashimoto

Tetsuji Takeuchi

Noriyasu Tanimoto

Eiji Kawabe

Izumi Akashi

Kazuaki Okubo

Kazuhisa Matsuo

Shoetsu Sakamoto

Syouetu Sakamoto

Nobuyuki c/o Matsushita Electric IndCo Matsui

An LED lamp provides a strong red color with a natural appearance. The LED lamp is provided with an LED module and a filter. The LED module includes a blue LED with a main emission peak in the 440 nm to 460 nm wavelength band, a green/yellow phosphor that is excited by light emitted by the blue LED, and a red phosphor that is excited by light emitted by at least one of the blue LED and the green/yellow phosphor. The filter reduces the spectral radiation intensity of at least a portion of the 570 nm to 590 nm wavelength band among light emitted by the LED module.

LED lamp, LED illumination device, and LED module

A backlight apparatus comprises a light source that is composed of a combination of a blue light emitting device, a green light emitting phosphor, and a red light emitting phosphor. The blue light emitting device has a peak intensity of a light emitting spectrum 3 to 19 times as high as the green light emitting phosphor.

Backlight apparatus, light source for backlight apparatus, and display apparatus using the same

An LED lampincludes: an LED chip; a phosphor resin portionthat covers the LED chip; and a light-transmissive memberthat covers the phosphor resin portion. The phosphor resin portionincludes: a phosphor for converting the emission of the LED chipinto light that has a longer wavelength than the emission; and a resin in which the phosphor is dispersed. The surface of the light-transmissive memberincludes an upper surface portionlocated over the LED chipand a side surface portionlocated around and below the upper surface portion. At least a part (low-transmittance part) of the side surface portionof the light-transmissive memberhas lower transmittance than the upper surface portion

LED lamp

A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board, a distance D between wiring patternsanddisposed so as to oppose each other is the smallest at a position nearest to a center point (G) of an LED chipdisposed at a designed location, and increases with an increasing distance from the point G. In addition, pattern edgesandof the wiring patternsandrecede in the direction of widening the distance D as a distance from the center point G increases with respect to electrode edgesandof the LED chip

Lighting device having a lighting unit with an optical semiconductor bare chip mounted on printed wiring board

An LED lamp according to the present invention includes: at least one LED chipthat is mounted on a substratea phosphor resin portionthat covers the LED chipa lensto act on the outgoing light of the phosphor resin portionand an optical diffusion layer (light-transmissive resin portion), which is arranged between the phosphor resin portionand the lensand in which particles to scatter the light are dispersed.

LED lamp provided with optical diffusion layer having increased thickness and method of manufacturing thereof

An LED lamp includes at least one LED chip mounted on the principal surface of a substrate and an optical wavelength converting portion, which includes a phosphor for converting the emission of the LED chip into light having a longer wavelength than that of the emission and which covers at least a portion of the LED chip. The side surface of the optical wavelength converting portion has at least one concave curved surface portion.

LED lamp and method for manufacturing the same

An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

LED illumination apparatus and card-type LED illumination source

Light emitting diode lamp unit

A socket fixed to a heat sink holds a card-type LED module formed by integrating LED elements. The socket () includes: a frame structure for holding the LED module () with its light source unit exposed through the frame opening; and a pressing member positioned around the opening for pressing the back surface of the LED module against the heat sink (). The socket may include a structure including a lower member () placed on a heat sink and an upper frame member () holding the LED module with its light source unit () exposed through the frame opening. The upper member supported by the lower member via a hinge can open/close, and includes a pressing unit pressing the LED module set in the open state, against the lower member (). The lower member () includes, in its main part, a lock unit () directly or indirectly lock the upper member () when the upper member is closed.

Socket for led light source and lighting system using the socket

In a module socket, a connecter and a connector are connected by wiring, and three LED modules are connected in parallel with respect to a constant voltage circuit unit via the wiring. Each module has a constant current circuit unit and an LED mounting unit. The constant current circuit unit includes one resistor and two transistors mounted on a surface of a sub-substrate on which a conductive land is formed. The sub-substrate is bonded to a main substrate.

Multichip LED lighting device

An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.

An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Card-type LED illumination source

Growing community of inventors

Kyotanabe, Japan

Masanori Shimizu