Rohm & Haas Electronic Materials LLC

Masanori Orihashi

Yutaka Morii

Yasushi Takizawa

A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.

Acidic gold alloy plating solution

A tin plating solution and tin plating method for chip components minimizes tin shavings when plated components are rubbed together such as during bulk mounting. This minimizes sticking of the chip components together.

Tin electroplating solution and a method for tin electroplating

A hard gold plating solution and plating method which provides a gold plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine.

Hard gold alloy plating bath

To provide a solder-plating film which has good solder wettability and with which discoloration and twisting of the tin film after heat treatment are prevented. A method and a solution for surface treating a tin film are disclosed. The aqueous solution contains specific compounds and is brought into contact with a tin-plating film before reflow treatment of the tin film.

Growing community of inventors

Ageo, Japan

Masanori Orihashi