Denso Corporation

Toyota Jidosha Kabushiki Kaisha

Masanori Ooshima

Takahiro Hirano

Tomomi Okumura

Eiji Hayashi

Naoya Take

Shun Sugiura

Sachio Kodama

A semiconductor device includes a semiconductor element, a sealing body, and a plurality of terminals. The sealing body seals the semiconductor element therein. The terminals are electrically connected to the semiconductor element inside of the sealing body, and project from the sealing body. Each of the terminals has a rough surface area having a larger surface roughness than a peripheral area in a section in a longitudinal direction of the terminal.

Semiconductor device

A semiconductor device incudes: a semiconductor chip that includes an active area and an outer peripheral area surrounding the active area; a metal member that includes one face including a mounting portion on which the semiconductor chip is mounted and a peripheral member surrounding the mounting portion; a joining member that connects the semiconductor chip and the metal member; and a sealing resin body. The metal member includes, as the peripheral portion, an adhesive portion that surrounds the mounting portion and adheres to the sealing resin body, and a non-adhesive portion that is placed between the mounting portion and the adhesive portion. An entire width is placed in an area overlapping the semiconductor chip in a projection view in a thickness direction of the semiconductor chip.

A semiconductor device may include a semiconductor element including a signal pad, an encapsulant encapsulating the semiconductor element and a lead including a first end located outside the encapsulant and a second end located within the encapsulant. The lead may be connected to the signal pad via a bonding wire within the encapsulant. The lead may include an upper surface extending from the first end to the second end. The upper surface may include a joined section where the bonding wire is joined and a rough section located within the encapsulant and having a higher surface roughness than the joined section. The rough section may be at least partly located lower than the joined section.

In an electronic device including an electronic component, a sealing resin body, a first member having at least a portion located in the sealing resin body, and a second member connected to the first member via a solder in the sealing resin body, the first member includes a base material formed of a metal material and a coated film at least on a surface of the base material which is adjacent to a back surface of the first member opposite to a facing surface of the first member facing the second member. The coated film includes a metal thin film on a surface of the base material and an uneven oxide film on the metal thin film and made of an oxide of a same metal as a main component of the metal thin film.

Growing community of inventors

Kariya, Japan

Masanori Ooshima