Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Hitachi Astemo Ltd.

Masanori Miyagi

Takashi Naito

Takuya Aoyagi

Motomune Kodama

Tadashi Fujieda

Yuichi Sawai

Takeshi Tsukamoto

Hajime Murakami

Shinichi Tachizono

Yuji Hashiba

Kei Yoshimura

Akihide Tanaka

Hirotsugu Kawanaka

Hiroshi Yoshikawa

Haruo Akahoshi

Hiroshi Hozoji

Yujiro Kaneko

Masao Shimizu

Nobutake Tsuyuno

Toshihiro Yamada

Yusuke Takagi

Hiroki Murakami

Norihisa Iwasaki

Yoshiyuki Takamori

Seunghwan Park

Xudong Zhang

Nobuhiro Kakeno

Hisashi Endou

Yasunori Hama

Kazumichi Hosoya

A power conversion device including: a semiconductor device; a first water channel and a second water channel stacked in a predetermined stacking direction and installed with the semiconductor device interposed therebetween; and a connecting water channel connecting the first water channel and the second water channel, in which the connecting water channel is formed by joining and fixing a joint member joined to the first water channel and the second water channel and a cover member separate from the joint member to each other, the first water channel and the second water channel are joined to the joint member by a joint formed in a plane parallel to the stacking direction, and the cover member covers the joint and is joined and fixed to the joint member.

Power conversion device and method for manufacturing power conversion device

A control device is provided with: a posture information storage unit that stores posture associated information associated with workability being an evaluation criterion at a time of a posture for each piece of posture information of an operator; a posture information detection unit that acquires posture information of the operator during work as current posture information; a posture information calculation unit that obtains, from the posture associated information, ideal posture information for making improvement on workability of the current posture information, obtained by referring to the posture associated information in the storage unit from the current posture information; and a posture information notification unit that notifies the ideal posture information obtained by the calculation unit as an improvement proposal.

Work support device and work supporting method

A control device includes a storage unit that stores motion assessment index information for mapping a normal range for doing work motion to associated knowledge about the normal range, a motion information detection unit that detects motion information which is the result of measuring motion of a trainee, a motion determination unit that determines whether or not the motion information detected by the motion information detection unit deviates from the normal range stored in the storage unit, and a notification unit that acquires from the storage unit the associated knowledge mapped to the normal range from which the motion determination unit determines that the motion information deviates, and gives notice of the associated knowledge.

Skill training device and skill training method

The disclosure provides a joining process line monitoring system capable of preventing joining quality deterioration and operation delay. A joining process line monitoring systemincludes a joining phenomenon data acquisition partconfigured to acquire a joining phenomenon of a joining subject member as phenomenon data; an operation state data acquisition partconfigured to acquire a joining operation state of the joining subject member as operation state data; an evaluation data calculation unitconfigured to perform time synchronization of the acquired phenomenon data and the acquired operation state data, and associate the acquired phenomenon data and the acquired operation state data with each joining operation location, so as to calculate evaluation data; a difference data extraction unitconfigured to extract a difference between the evaluation data and reference data set in advance as difference data; an abnormal location determination unitthat determines that a portion having a large difference from the joining phenomenon is an abnormal location; and a presentation unitconfigured to present the abnormal location of a joining portion of the joining subject member based on the difference data.

Joining process line monitoring system

In order to realize stable quality control, provided is a quality control device () having an input device which receives data such as an operation condition of each device () to () in a production system () for producing a product; a calculation unit which assigns a value of the operation condition to a correlation formula calculated in advance and calculates a value derived from the correlation formula; and a determination unit which performs good or bad determination on a quality of a workpiece in each process, on the basis of a result calculated by the calculation unit. Further, when 'bad' is determined as a result of the good or bad determination, the quality control device () calculates an appropriate value of the operation condition and sets the value to each device () to ().

Quality control device and quality control method

A welding apparatus includes: a laser beam irradiation section that emits a laser beam; a spectroscopic apparatus that receives plasma emission from a molten pool formed by laser beam irradiation, and acquires optical spectral information; and an estimation section that estimates material components of a weld zone on the basis of the optical spectral information, and estimates a property of the weld zone on the basis of the material components.

Welding apparatus and welding quality inspection method

A sealed structural body has an internal space and is made of glass, wherein at least a part of a boundary between the internal space of the sealed structural body and the outside is separated by a sealing material containing a metal material and a lead-free oxide glass. The lead-free oxide glass contains at least one of element Ag or P, Te, and V.

Sealed structural body and method for manufacturing the same

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.VO+TeO+FeO+PO&#x2265;90 (mass %)&#x2003;&#x2003;(1)VO&#x3e;TeO&#x3e;FeO&#x3e;PO(mass %)&#x2003;&#x2003;(2)

Electronic component, method for producing same, and sealing material paste used in same

The deterioration of the resin base materials in the bonded structure is prevented. In a bonded structure containing two base materials at least one of which is a resin, an oxide which contains either P or Ag, V, and Te, and are formed by softening on the two base materials, bond the two base materials. In addition, in a method for producing a bonded structure containing two base materials at least one of which is a resin containing: supplying an oxide containing either P or Ag, V, and Te to the base material; and applying electromagnetic waves to the oxide, whereby the oxide, which soften on the substrates, bond the two base material.

Bonded structure and production method therefor

An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of AgO in terms of oxides and the glass transition point is 180&#xb0; C. or less.

Solder, aluminum wire body and motor using the same

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing to melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.VO+TeO+FeO+PO&#x2267;90(mass %)&#x2003;&#x2003;(1)VO&#x3e;TeO&#x3e;FeO&#x3e;PO(mass %)&#x2003;&#x2003;(2)

In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5&#xd7;10/&#xb0; C. or less in a temperature range from 30 to 250&#xb0; C. This invention makes it possible to heat the filler particles by irradiation with a laser to give the electronic component which is a component having a highly reliable bonding portion.

Electronic component, process for producing same, sealing material paste, and filler particles

Disclosed is a jointed body wherein multiple base members are jointed to each other through a jointing layer, and at least one of the base members is a base member of a ceramic material, semiconductor or glass. The joint material layer contains a metal and an oxide. The oxide contains V and Te, and is present between the metal and the base members. Disclosed is also a joint material in the form of a paste containing an oxide glass containing V and Te, metal particles, and a solvent; in the form of a foil piece or plate in which particles of an oxide glass containing V and Te are embedded; or in the form of a foil piece or plate containing a layer of an oxide glass containing V and Te, and a layer of a metal.

Joint material, and jointed body

The present invention is intended to increase the moisture resistance of a resin-sealed electronic control device. The resin-sealed electronic control device includes: a semiconductor chip; a chip capacitor; a chip resistor; a bonding member; a substrate; a case; a heat radiating plate; a glass coating; and a first sealing material. The glass coating directly covers the electronic circuit formed by the element group including: the semiconductor chip; the chip capacitor; and the chip resistor, the bonding member and the substrate, and is sealed by the first sealing material. By being water impermeable, the glass coating prevents water absorption in the vicinity of the element group, and can prevent an increase in the leak current of the semiconductor chip due to water absorption, and an insulation performance drop such as lowered insulation resistance caused by migration within the element group.

Resin-sealed electronic control device

A laser processing system includes a laser processing head, a powder supply device, and a controller. The powder supply device supplies powder to the laser processing head. The laser processing head includes: a laser emission unit which irradiates a workpiece with laser light; and a powder supply unit which receives the powder supplied from a powder supply device to the laser processing head, and can supply the powder to a laser spot on the workpiece. The powder supply unit includes: a powder discharge unit which can discharge the powder toward the laser spot on the workpiece; and a powder-supply control mechanism which controls the amount of the powder to be supplied to the powder discharge unit, by distributing to the powder discharge unit at least a part of a flow of the powder supplied from the powder supply device. The controller controls the distributing by the powder-supply control mechanism.

Growing community of inventors

Tokyo, Japan

Masanori Miyagi