Mitsui High-Tec Incorporated

Masanori Mitsui

Koji Shimizu

Masanori Mikawa

Provided is a lead frame by which a die pad can be easily exposed when the lead frame is used for a semiconductor device. The lead frame has a die pad with an upper surface on which a semiconductor element is mounted. The lead frame is used for the semiconductor device with the exposed surface of the die pad being exposed from a sealing resin. A downwardly-projecting first metal burr is formed along the peripheral portion of the exposed surface of the die pad and heads of the first metal burr are flat.

Lead frame, method for manufacturing lead frame and semiconductor device using same

In the surface of a lower die,in a resin sealing mold, a region where an external leads,of a lead frame,and its peripheral regions having a width of 0.1 mm are mirror-finished to form a mirror-face region,The other region than the mirror-face region is subjected to discharging processing to form a satin-finished region,The resin-sealing mold having such a structure permits a package to be smoothly released and prevents resin from remaining.

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Fukuoka, Japan

Masanori Mitsui