Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electronics Corporation

Masanori Minamio

Toshiyuki Fukuda

Tetsushi Nishio

Toru Nomura

Kouichi Yamauchi

Hiroaki Fujimoto

Katsutoshi Shimizu

Yuichiro Yamada

Fumihiko Kawai

Noriyuki Yoshikawa

Yoshiki Takayama

Osamu Adachi

Akira Oga

Hiroshi Horiki

Fumito Itoh

Yoshihiro Tomita

Tatsuo Sasaoka

Yutaka Harada

Zyunya Tanaka

Shinichi Ijima

Ryuichi Sahara

Kiyokazu Itoi

Hisaki Fujitani

Yukio Yamaguchi

Yoshinobu Kunitomo

Mutsuo Tsuji

Atsuhito Mizutani

Satoru Konishi

Yoshihiko Morishita

Kenji Tsuji

Takahiro Matsuo

Toru Okazaki

Koichi Nagai

Kenichi Itou

Yoshiyuki Arai

Tomoko Komatsu

Noboru Takeuchi

Hiroyuki Ishida

Takeshi Morikawa

Hideki Takehara

Yasuyuki Takano

Toshiro Kanda

Haruto Nagata

Fumito Ito

Ichiro Okumura

Masahiko Ohiro

Masanori Koichi

Yoshinori Satoh

Kunikazu Takemura

Akio Kuito

Koichi Yamauchi

Masahiro Kawata

Yasuhiro Nakamura

Hideyuki Nakanishi

Hiroshi Wada

Kenya Yamashita

Koji Nomura

Tadayoshi Nakatsuka

Terutsugu Segawa

Katsushi Tara

Akira Isomi

Genichiro Matsuda

Yasuhiro Asaida

Daisuke Tabata

Kiyoshi Fujihara

Fuminori Takami

Gaku Miyake

Yoshio Yamada

Hiroki Ikeuchi

Takahiro Kitai

Masaya Tateyanagi

Shuichi Ogata

Eizou Fujii

Tetsumasa Maruo

Shigeki Okamoto

Hisanori Ishiguro

Kenji Furumoto

Yukiko Kitahara

Satoru Waga

Ryoutarou Imura

Shin-ichi Ijima

Keiko Takahashi

Taku Gobara

Kenichi Nishiyama

Hikari Sano

Hikaru Sano

Mutsuo Tshuji

Kyoko Fujii

Hideki Sakota

Takahito Ishikawa

Daisuke Ujihara

Shin-Ichi Ijima

The cooling apparatus includes: a thermal insulation box; a door; and a magnetic gasket, the magnetic gasket having: a magnet; a magnet retaining part; and a heat insulation sheet being provided between the magnet and the magnet retaining part and being provided, in a closed state in which the opening is closed by the door, on a side portion on a side of the door on a peripheral surface of the magnet and on a side portion facing an inner side in a width direction in the closed state on the peripheral surface of the magnet.

Magnetic gasket and cooling apparatus

A state monitoring method for thermosetting resin includes, in a curing treatment of thermosetting resin, detecting a moisture content of the thermosetting resin during the curing treatment; and determining a cross-linking state of the thermosetting resin during the curing treatment based on the detected moisture content. It is possible to determine the cross-linking state of the thermosetting resin by detecting the moisture content of the thermosetting resin during the curing treatment.

State monitoring method and state monitoring system for thermosetting resin

An apparatus for producing reforming liquid includes a treatment tank in which an introduced liquid is swirled so as to generate a gas phase in the vicinity of a swirling center of a swirling flow of the liquid, a first electrode which has at least a portion which is disposed in the treatment tank and comes into contact with the liquid in the treatment tank, a second electrode which is disposed so as to come into contact with the liquid in the treatment tank and a power source which is configured to apply a voltage between the first electrode and the second electrode so as to generate plasma in the gas phase. A reformed liquid is produced in a manner that the plasma is generated in the gas phase so as to form a reformed component, and the formed reformed component is dissolved and dispersed in the liquid.

Apparatus for producing reforming liquid and method for producing reforming liquid

Disclosed are a dew condensation removal structure that removes dew condensation generated in equipment using cold such as refrigerating/freezing equipment and air conditioning equipment and that suppresses power consumption necessary to remove the dew condensation, and cooling/heating equipment including the dew condensation removal structure. The cooling/heating equipment uses the dew condensation removal structure, including: a cooling structure having a cooling surface that is directly or indirectly cooled by cold, the cooling surface facing outside air; and a dew condensation conveyance section provided on the cooling surface, in which the dew condensation conveyance section has a conveyance path that conveys dew condensation by capillary phenomenon, the dew condensation being generated on a surface of the dew condensation conveyance section.

Dew condensation removal structure and cooling/heating equipment including dew condensation removal structure

Provided is a solvent separation method and a solvent separation apparatus that make it possible to efficiently retrieve the thermal energy possessed by an exhaust atmosphere released in a solvent-removal step to suppress reductions in a temperature of the exhaust atmosphere. In the solvent separation method and the solvent separation apparatus, a vaporized solvent is removed from a gas while heat exchange between the gas within a condensation part and the gas within a dust-collection part is conducted by using a heat exchange part that is placed between the condensation part that introduces the gas into a first direction and the dust-collection part that introduce the gas into a second direction opposite to the first direction the gas discharged from a downstream side of the condensation part.

Solvent separation method and solvent separation apparatus

Provided are a solvent separation method, a solvent separation apparatus, and a solvent separation system that make it possible to easily collect a solvent removed from an exhaust atmosphere and that make it possible to easily carry out maintenance of exhaust gas pathways. An impeller placed in a storage space of a casing is rotated to introduce a gas including a volatilized solvent from an inlet of the casing into the storage space, and the volatilized solvent is cooled and devolatilized by a collection face that has been cooled so as to have a surface temperature lower than the temperature of the gas, to thereby separate the solvent from the gas.

Solvent separation method, solvent separation apparatus and solvent separation system

A sanitization mist shower apparatus includes a water tank that stores water, a plasma generator that causes a plasma discharge in water inside the water tank and generates reformed water, an air blower that blows pressurized air, and a mist nozzle that spouts fine mist obtained by mixing the reformed water supplied from the water tank and the pressurized air supplied from the air blower. A liquid pressure of the reformed water supplied to the mist nozzle and air pressure of the pressurized air are substantially the same as each other.

Sanitization mist shower apparatus

A semiconductor device includes: a block module which internally includes a power semiconductor element and a first heatsink, and from which a main circuit terminal and a control terminal are drawn; a control substrate connected to the control terminal; a package in which the block module and the control substrate are housed; and a second heatsink to which the package is fixed by a connection screw. The connection screw is inserted into the second heatsink so as to be inclined at an inclination angle &#x3b8; relative to a normal to a surface of the second heatsink.

Semiconductor device and method for manufacturing same

In a method for manufacturing a semiconductor device according to the present invention, as shown in FIG.(A), a case () including a first terminal () is placed on a working table () with an opening () formed at the bottom of the case (). Subsequently, as shown in FIG.(B), a plurality of packages () including second terminals () are placed on the working table () through the opening () of the case (), forming a clearance () between the first terminal () and the second terminal (). As shown in FIG.(C), a bonding material () is disposed in the clearance () so as to electrically connect the first terminal () and the second terminal (). Thus, the exposed surfaces of the packages () in the opening () of the case () are aligned at the same height, thereby reducing variations in thermal resistance among the packages ().

Method for manufacturing semiconductor device and semiconductor device

A semiconductor device is a resin package structure including a semiconductor element Tmolded with a first resin. The first resincontains a fillerincluding an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the fillerachieves a structure with satisfactory heat dissipation and a high withstand voltage.

Electrical component resin, semiconductor device, and substrate

An encapsulated semiconductor device includes: a first conduction path formative plate; a second conduction path formative plate joined to the first conduction path formative plate; a power element bonded to the first conduction path formative plate; a heatsink held by the first conduction path formative plate with an insulation sheet interposed between the heatsink and the first conduction path formative plate; and an encapsulation resin configured to encapsulate the first and second conduction path formative plates. A through hole or a lead gap is formed in a region of the first conduction path formative plate in contact with the insulation sheet. The insulation sheet is press-fitted into the through hole or the lead gap.

Encapsulated semiconductor device and method for manufacturing the same

A semiconductor device includes a package, a block-module, and a control boardfor controlling power semiconductor elements. The block-modulehas embedded power semiconductor elementsand second leadsand first leadsthat are drawn from the block-module. The packagehas external connection terminalsin contact with the first leadsof the block-module. The second leadsare connected to the control boardwhile the first leadsare joined to the external connection terminals

Semiconductor device and method of manufacturing the same

An encapsulated semiconductor device includes: a first conduction path formative plate (); a second conduction path formative plate () joined to the first conduction path formative plate; a power element () bonded to the first conduction path formative plate; a heatsink () held by the first conduction path formative plate with an insulation sheet () interposed between the heatsink and the first conduction path formative plate; and an encapsulation resin () configured to encapsulate the first and second conduction path formative plates. A through hole () or a lead gap () is formed in a region of the first conduction path formative plate in contact with the insulation sheet. The insulation sheet is press-fitted into the through hole or the lead gap.

A joined body which is formed by, first, an aqueous solution containing an oxide film remover is disposed on a junction region of a first metal plate. Then, with the aqueous solution remaining on the first metal plate, a second metal plate is placed on the first metal plate. Thereafter, a load is applied to junction regions of the first metal plate and the second metal plate in the vertical direction, thereby joining the first metal plate and the second metal plate together to form a junction portion.

Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the same

A semiconductor device of the present invention comprises: an outer package; a first lead frame including a first relay lead, a first die pad with a power element mounted thereon, and a first external connection lead which has an end protruding from the outer package; and a second lead frame including a second relay lead, a second die pad with a control element mounted thereon, and a second external connection lead which has an end protruding from the outer package, wherein the first die pad and the second die pad or the first external connection lead and the second relay lead are joined to each other at a joint portion, and an end of the second relay lead extending from a joint portion with the first relay lead is located inside the outer package.

Semiconductor device

Growing community of inventors

Osaka, Japan

Masanori Minamio