Ibiden Company Limited

Tibc Co., Ltd.

Masanori Kawade

Naohiro Hirose

Yoshiyuki Iwata

Hajime Yazu

Hitoshi Ito

Hiroyuki Tsuruga

Makoto Ebina

A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.

Conductive pin attached to package substrate

A lead pin comprising including a body having a shaft portion and a flange portion. The flange portion has at least one flat portion configured to face a connection pad and groove portions positioned to face toward the connection pad and extending from a peripheral portion toward a center portion of the flange portion, the flat portion includes extending portions extending from a center of the flange toward the peripheral portion of the flange and connected at the center of the flange, and the groove portions are tilted to become deeper toward the peripheral portion of the flange.

Lead pin for mounting semiconductor and printed wiring board

A package substrateincorporating a substrate provided with a conductor layer, a conductive connecting pinarranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a padfor securing the conductive connecting pin is provided for the package substrate. The padis covered with an organic resin insulating layerhaving an openingthrough which the padis partially exposed to the outside. The conductive connecting pinis secured to the pad exposed to the outside through the opening with a conductive adhesive agentso that solution of the conductive connecting pinfrom the substrate occurring, for example when mounting is performed is prevented.

Package substrate with a conductive connecting pin

A package substrateincorporating a substrate provided with a conductor layer, a conductive connecting pinarranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a padfor securing the conductive connecting pin is provided for the package substrate. The padis covered with an organic resin insulating layerhaving an openingthrough which the padis partially exposed to the outside. The conductive connecting pinis secured to the pad exposed to the outside through the opening with a conductive adhesive agentso that solution of the conductive connecting pinfrom the substrate occurring, for example when mounting is performed is prevented.

Conductive connecting pin for package substance

Conductive connecting pin and package substrate

Conductive connecting pins for a package substrate

A semiconductor loading lead pin that does not tilt at a time of reflow. A void is sometimes left in solder between an electrode pad and the flange of a semiconductor loading lead pin. When reflow is carried out to load an IC chip, the solder for connection is melted and at the same time, the void in the solder is expanded. The solder escapes sideway along the groove portion, and thereby a flange is not raised by the void so that the semiconductor loading lead pin is not tilted.

Growing community of inventors

Ibi-gun, Japan

Masanori Kawade