Fujifilm Corporation

Masanori Hikita

Kenichiro Sato

Wataru Kikuchi

Yasufumi Ooishi

Masatoshi Yumoto

Kyouhei Sakita

Youhei Ishiji

Disclosed is a photosensitive resin composition comprising: (Component A) an oxime sulfonate compound represented by Formula (1); (Component B) a resin comprising a constituent unit having an acid-decomposable group that is decomposed by an acid to form a carboxyl group or a phenolic hydroxy group; and (Component C) a solvent wherein in Formula (1) Rdenotes an alkyl group, an aryl group, or a heteroaryl group, each Rindependently denotes a hydrogen atom, an alkyl group, an aryl group, or a halogen atom, Ardenotes an o-arylene group or an o-heteroarylene group, X denotes O or S, and n denotes 1 or 2, provided that of two or more Rs present in the compound, at least one denotes an alkyl group, an aryl group, or a halogen atom.

Photosensitive resin composition, oxime sulfonate compound, method for forming cured film, cured film, organic EL display device, and liquid crystal display device

A positive photosensitive resin composition including: a resin comprising a structural unit having an acid dissociative group and a structural unit having a functional group capable of forming a covalent bond by reacting with a carboxyl group or a phenolic hydroxyl group; and an acid generator represented by the following formula (I): 

Positive photosensitive resin composition, method for forming cured film, cured film, organic el display device and liquid crystal display device

A polymer compound is provided which is excellent in heat resistance and insulating property, and a photosensitive resin composition is provided which includes the polymer compound, and may form a cured pattern or a cured film excellent in pattern forming property, resolution, heat resistance and insulating property. Also, a method for forming a cured pattern excellent in pattern forming property, resolution, heat resistance and insulating property using the photosensitive resin composition, and an electronic device having high reliance for a semiconductor device or for a display device are provided. The photosensitive resin composition includes a polymer compound obtained by reacting a monomer represented by Formula (1) and a monomer represented by Formula (2), and a photosensitizing agent. 

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Shizuoka-ken, Japan

Masanori Hikita