Toray Engineering Company, Limited

Other

Masanori Akita

Toshihiro Mori

Koji Ito

Richard H Estes

Yoshiki Sawaki

Minoru Wada

Minoru Nakamura

James Elliott Clayton

Kenji Sato

Takashi Kubota

Yoshio Nogami

Hiroaki Tsuruta

Koji Itoh

Hiromitu Wada

Fujio Murai

Koichi Mimura

Yoshio Kuramoto

Mayumi Aimoto

Atushi Suzuki

Provided is a non-contact ID card which is superior in the productivity and the electrical properties, and a method capable of manufacturing such non-contact ID card. The non-contact ID card of the present invention is characterized in that the non-contact ID card comprises an antenna circuit board in which an antenna is formed on a substrate and an interposer board in which an enlarged electrode, which is connected to an electrode of an IC chip, is formed on a substrate on which the IC chip is mounted. The non-contact ID card is formed by laminating both boards in such a manner that the electrode of the antenna and the enlarged electrode are bonded, in which both electrodes are adhesively bonded by an insulating adhesive filled in minute recesses dispersed on bonding faces of the electrode of the antenna and/or the enlarged electrode.

Non-contact ID card and manufacturing method thereof

A low-cost non-contact ID card having practical electrical properties and the like is disclosed. The non-contact ID card comprises an antenna circuit board wherein an antenna is formed on a substrate and an interposer board wherein an enlarged electrode is formed on a substrate that is mounted with an IC chip. The enlarged electrode is connected to an electrode of the IC chip. The antenna circuit board and the interposer board are joined in such a manner that an electrode of the antenna is in direct contact with the enlarged electrode which is a resin electrode made of a conductive resin containing a thermoplastic resin.

Non-contact ID card and the like and method for manufacturing same

There are disclosed; an active energy beam curing type conductive paste, containing a conductive substance, and an active energy beam polymerizable compound, wherein a cured matter, obtained when a composition of the paste excluding the conductive substance is cured with an electron beam having an acceleration voltage of 150 kV and an irradiated dose of 40 kGy, has an internal stress of 5 to 50 Mpa; a production method and a device for a conductor circuit substrate using the active energy beam curing type conductive paste; and a non-contact ID using the active energy beam curing type conductive paste and a production method for the ID.

Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact ID and production method thereof

A noncontact ID card composed by laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip and bonding between an antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board with electroconductive adhesive material, wherein a substrate of the antenna circuit board and a substrate of the interposer board are bonded. In addition, in another composition, at least one local deformation is applied to a boding face of the electrodes each other in a direction crossing the bonding face.

Noncontact ID card and method of manufacturing the same

In a probe apparatus comprising an inspecting device, an intermediate substrate and a probe substrate, in which the inspecting device is electrically connected to a proximal end of the intermediate substrate, and the intermediate substrate has a distal end electrically connected to a proximal end of the probe substrate, and the probe substrate has a distal end electrically connectable to a substrate under inspection, a plurality of probe substrates are electrically connected to the single intermediate substrate. When a particular probe substrateis damaged, only the particular probe substratemay be changed, the other probe substratescontinuing to be used, thereby achieving economy.

Probe apparatus manufacturing method thereof and substrate inspecting method using the same

A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.

Method of fabricating a COF utilizing a tapered IC chip and chip mounting hole

This noncontact ID card or the like comprises an antenna circuit board having an antenna formed on a substrate and an interposer board having expanded electrodes formed on a substrate where an IC chip is embedded, the expanded electrodes being connected to electrodes of the IC chip, wherein both boards are stacked in such a way that the electrodes of the antenna are joined to the expanded electrodes.

Noncontact id card or the like and method of manufacturing the same

The invention provides processes for bonding a flip chip to a substrate in a manner that maximizes reliability of the bonding operation. Electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. Electrically conductive polymer bumps are formed on bond pads of a substrate, and a layer of electrically insulating adhesive paste is then applied on the substrate, covering the substrate polymer bumps with the adhesive. The bond pads of the flip chip are then aligned with the bond pads of the substrate and the at least partially hardened flip chip polymer bumps are then pushed through the substrate adhesive and at least partially into the substrate polymer bumps. In a further method, electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. A layer of electrically insulating adhesive paste is formed on a substrate having bond pads, covering the bond pads with the adhesive. The bond pads of the flip chip are aligned with the bond pads of the substrate, and then the at least partially hardened flip chip polymer bumps are pushed through the substrate adhesive with pressure sufficient for the flip chip polymer bumps to directly contact and deform the substrate bond pads.

Flip chip mounting technique

In a flip chip bonding method, polymer bumps are formed, using a bonding tool, on an IC chip, held via suction to the bonding tool. An insulating adhesive film is pressed onto the upper surface of a circuit board held via suction with a suction stage. Heat is then applied to bring the film into close contact with bond pads of the circuit board. At this point, the bonding tool is moved downward, bonding the polymer bumps to the circuit board electrodes. During the time of this downward movement, bonding of the polymer bumps to the circuit board bond pads can be achieved by piercing the insulating adhesive film with the polymer bumps, and it is found that strong bonding can be achieved with adequate reliability. This method eliminates the need for a process in which through-holes must be pierced in the insulating adhesive film to accommodate the polymer bumps.

A resin etching solution containing a hydroxyalkylamine, an alkali metal compound and water, or an aliphatic alcohol, an aliphatic amine, an alkali metal compound and water, and a process for etching a polyimide film containing a resist pattern or metal layer pattern formed on either or both sides using the resin etching solution.

Resin etching solution and process for etching polyimide resins

The invention provides a flip chip mounting process in which a layer of electrically insulating adhesive paste is applied on a substrate having bond pads, covering the bond pads with the adhesive. Electrically conductive polymer bumps are formed on bond pads of a flip chip to be bonded to the substrate, and the polymer bumps are at least partially hardened. The bond pads of the flip chip are then aligned with the bond pads of the substrate, and the at least partially hardened polymer bumps are pushed through the adhesive on the substrate to contact directly and bond the polymer bumps to the bond pads of the substrate. This process results in direct electrical and mechanical bonding of the polymer bumps between the chip and substrate bond pads, even though the adhesive film was applied on the substrate in a manner that covered the substrate bond pads. The polymer bumps displace the adhesive as they are pushed through it and expand laterally on the substrate bond pads. As a result, the area around the polymer bumps between the chip and the substrate is filled with the adhesive, in the manner of an underfill, whereby a separate, post-bond underfill process is not required.

Growing community of inventors

Otsu, Japan

Masanori Akita