Sony Corporation

Sony Chemical & Information Device Corporation

Tessera Interconnect Materials, Inc.

Masanobu Yagi

Atsuhiro Uratsuji

Yoshiyuki Ukeda

Tatsutoshi Narita

Tomoo Iijima

Kazuhiro Shimizu

Kenichiro Hanamura

Mitsuyuki Takayasu

Kiyoe Nagai

A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.

Method for manufacturing multilayer wiring board

A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unitfor etching landsformed on the printed wiring board, a rinsing unitfor rinsing the printed wiring board, a bubble removingfor removing air bubblesattached to the printed wiring boardon immersing the printed wiring boardin a water-soluble pre-flux liquidin a processing vessel, a pre-flux forming unitfor forming a pre-flux filmon the landsof the printed wiring boardin the pre-flux liquidusing an in-liquid spraying unit, a liquid removing unitfor removing the pre-flux liquidfrom the printed wiring boardtransported from the processing vesseland a rinsing unitfor rinsing the printed wiring board

Method and apparatus for surface processing of printed wiring board

A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unitfor etching landsformed on the printed wiring board, a rinsing unitfor rinsing the printed wiring board, a bubble removing unitfor removing air bubblesattached to the printed wiring boardon immersing the printed wiring boardin a water-soluble pre-flux liquidin a processing vessel, a pre-flux forming unitfor forming a pre-flux filmon the landsof the printed wiring boardin the pre-flux liquidusing an in-liquid spraying unit, a liquid removing unitfor removing the pre-flux liquidfrom the printed wiring boardtransported from the processing vesseland a rinsing unitfor rinsing the printed wiring board

A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unit for etching lands formed on the printed wiring board , a rinsing unit for rinsing the printed wiring board , a bubble removing unit for removing air bubbles attached to the printed wiring board on immersing the printed wiring board in a water-soluble pre-flux liquid in a processing vessel , a pre-flux forming unit for forming a pre-flux film on the lands of the printed wiring board in the pre-flux liquid using an in-liquid spraying unit , a liquid removing unit for removing the pre-flux liquid from the printed wiring board transported from the processing vessel and a rinsing unit for rinsing the printed wiring board

Growing community of inventors

Ishikawa, Japan

Masanobu Yagi