Tokyo Electron Limited

Masanobu Watanabe

Katsunori Ichino

Shinichi Hatakeyama

Kentaro Yoshihara

Masashi Itonaga

Seiya Totsuka

Tomoki Okazawa

Kouzo Nishi

A substrate processing apparatus includes: a rotary holder configured to hold and rotate a substrate; a liquid supplier including a nozzle that ejects a processing liquid; a driver configured to move the nozzle between a center of the substrate and a peripheral portion of the substrate; and a controller configured to: execute a supply control to supply the processing liquid to the surface of the substrate so as to form a supply trajectory in a spiral shape, by ejecting the processing liquid from the nozzle while rotating the substrate and moving the nozzle from the center of the substrate toward the peripheral portion of the substrate; and when executing the supply control, gradually reduce an ejection amount of the processing liquid per unit area on the surface of the substrate, at least in a portion forming an outermost periphery of the supply trajectory.

Substrate processing apparatus and substrate processing method

A substrate processing apparatus according to the present disclosure includes: a nozzle that ejects a processing liquid to a wafer; a force-feeding unit that force-feeds the processing liquid to the nozzle side; a liquid feeding pipeline that includes first and second valves and guides the processing liquid from the force-feeding unit to the nozzle; and a controller. The controller is configured to perform opening the first valve in a state where the second valve is closed and a pressure between the first and second valves is higher than a pressure between the force-feeding unit and the first valve, controlling the force-feeding unit to increase the pressure between the first and second valves that has been decreased by the opening of the first valve, and opening the second valve after the pressure between the first and second valves is decreased by the opening of the first valve.

Substrate processing method, substrate processing apparatus and storage medium

The present disclosure provides an apparatus for generating a processing gas by bubbling a raw material liquid with a carrier gas. The processing gas generated by the bubbling is taken out from a vapor-phase portion above a liquid-phase portion of the raw material liquid through a taking-out unit. A first temperature adjusting unit performs a temperature adjustment of the liquid-phase portion and a second temperature adjusting unit performs a temperature adjustment of the vapor-phase portion such that the temperature of the vapor-phase portion is higher than the temperature of the liquid-phase portion.

Processing gas generating apparatus, processing gas generating method, substrate processing method, and storage medium

Growing community of inventors

Kumamoto, Japan

Masanobu Watanabe