Murata Manufacturing Co., Ltd.

Murata Mfg. Co., Ltd.

Masanobu Okada

Kiyoshi Kanagawa

Kazuyoshi Nakaya

Hiroyuki Nakaji

Katsuo Ito

Wataru Kakinoki

Yutaka Ida

Iku Nagai

Kenji Fukunabe

Hirofumi Doi

Junichi Nakasone

Tomoyuki Koide

Naoki Kitahora

Yasumasa Ueda

A power conditioner is provided that includes a heat dissipating member, multiple circuit boards, and a mounting auxiliary plate. A power conditioner circuit including an electric heat generating element is formed on each of the circuit boards. The circuit boards are mounted on a front surface of the heat dissipating member. Heat dissipating fins are arranged on a back surface of the heat dissipating member. Preferably, the heat dissipating member is formed from a material having high heat dissipation property. The mounting auxiliary plate is fixed to the back surface side of the heat dissipating member and provided with a through hole for mounting to a wall. The mounting auxiliary plate has higher rigidity than the heat dissipating member.

Power conditioner

A card-type apparatus includes a circuit substrate and a card-type case for accommodating the circuit substrate including a flat portion disposed opposite to the circuit substrate with a gap between the circuit substrate and the flat portion. A memory card accommodating space, provided between the flat portion of the card-type case and the circuit substrate, is capable of detachably accommodating the memory card inserted from a memory card slot along the circuit substrate surface. A terminal is provided on a region of the circuit substrate in the memory card accommodating space. A plate section for adjusting the gap is provided on the flat portion on the side of the memory card accommodating space. On the plate section, a protrusion is provided so as to increase the contact pressure between the memory card and the terminal by pressing the memory card stored in the memory card accommodating space against the terminal.

Card-type apparatus

A card apparatus includes a card case housing a circuit substrate, a case main body and an extended portion made of resin material and being disposed integrally with the case main body. The extended portion accommodates one end side portion of the circuit substrate. The case main body includes a metal cover disposed opposite to at least one of the front surface and the back surface of the circuit substrate. A metal cover extension extending from the metal cover and constituted of a first conductive plate is embedded in a case wall constituting the extended portion, and a second conductive plate constituting an antenna element is embedded in the case wall constituting the extended portion, the second conductive plate being provided at a predetermined distance apart from the metal cover extension.

Card apparatus and method of producing the same

In an antenna feed structure for electrically connecting a rotatable antenna to a circuit formed on a circuit board by means of a feeding metallic part, an antenna rotary shaft formed so as to protrude from one end of the antenna and formed of a conductor has a preferably spherical end. The feeding metallic part has a mounting portion, an antenna contact-and-connection portion, and an elastic supporting portion. The mounting portion is mounted to the circuit board. The antenna contact-and-connection portion is brought into contact with and is connected to the end of the antenna rotary shaft. The elastic supporting portion supports the antenna contact-and-connection portion at the mounting portion and produces biasing force towards the antenna rotary shaft from the antenna contact-and-connection portion. The antenna contact-and-connection portion has a recess wall preferably having a spherical shape which is in correspondence with the spherical shape of the end of the antenna rotary shaft. The spherical end of the antenna rotary shaft press-contacts the spherical recess wall of the antenna contact-and-connection portion.

Antenna feed structure

In a circuit board, when lands provided on a rear surface of a substrate are each separated into a mainland and a sub-land, warping or other defects of the substrate can be ignored when soldering, and the substrate can be mounted with a high bonding strength. On the rear surface of a module substrate, partitions are each provided to separate a metal film into the mainland and the sub-land. Accordingly, when the substrate is mounted on a motherboard, solder applied beforehand from each end-surface electrode to the mainland can be largely protruded downward from the mainland, and warping or other defects of the substrate can be ignored by this protruding portion of the solder. In addition, in the state in which the substrate is mounted, since the solder is pushed out from between the mainland and the motherboard and overflows the partition, both the mainland and the sub-land can be soldered to the motherboard side, and hence stable bonding can be obtained at a large bonding area.

Circuit board device and mounting method therefor

A device with a memory card insertion/removing mechanism has a memory card holder and a pushing-out member holder disposed in the device, and a slot communicating with the memory card holder. The pushing-out member holder communicates with the memory card holder. A pushing-out member is accommodated in the pushing-out member holder. The device has an opening exposing a portion of the pushing-out member to the exterior. The pushing-out member moves in a card insertion direction by the pushing force of a memory card when the memory card is inserted in the memory card holder from the slot, and pushes out the memory card in the memory card holder to the exterior when the pushing-out member is externally operated through the opening and is moved in a card push-out direction.

Device with memory card insertion/removing mechanism

A blanking plate is attached to the bottom surfaces of a split board and a remaining board, which are separated from one bare board. After depositing solder paste on a back electrode of the split board, a solder ball is attached on the solder paste. The split board is then heated to melt the solder ball. The molten solder flows along the back electrode and an edge electrode into a through-hole. A portion of the molten solder swells out of the bottom surface of the bare board, and solidifies and bonds to the back electrode and the edge electrode.

Method for manufacturing modular board

End-face through holes each comprising a concave-curved end-face opening groove and an end-face electrode covering the inner wall of the groove are formed in the end-faces of a substrate. Furthermore, a solder having a semi-circular shape is attached to the end-face electrode. The solder comprises an electrode facing portion facing the end-face electrode in the end-face groove, and a protuberant portion elongated from the electrode facing portion to protrude on the back-surface side of the substrate. Thereby, even if the substrate or the like is warped, a gap between the end-face electrode and the electrode pad of a mother board can be filled with the protuberant portion of the solder to connect the end-face electrode and the electrode pad to each other.

Module substrate and method of producing the same

A communication card and the structure of a jack therefor. The end face of the card is provided with a slit-like aperture. Into the aperture there is inserted a base plate having a thickness smaller than the width of the aperture so as to allow insertion into the interior of the card and removal from the card. The base plate is provided with a notch directed to the outside when viewed from the card. The notch passes through the base plate in the direction of its thickness. The jack is formed by utilizing this notch. The plug, on the other hand, is of a rectangular parellelpiped shape and is electrically coupled to a cord. The inner surface of the notch is configured so as to be able to receive the plug. When the plug is inserted, the notch receives and holds the plug. At that time, the notch receives and holds the plug in such a manner that the direction of the longest edge among the edges of the plug, or the extending direction of the cord is parallel to the major planes of the card.

Communication card and structure of jack for use in the same

A modular fitting open slit, which is open at its rear end part, for freely inserting a modular plug into and removing it from said modular fitting open slit is provided at a rear end part of a modem card, and said open slit is provided with inner walls which function as a guide part for setting a direction of insertion of a modular plug, an extreme end position setting part for positioning an extreme end of said modular plug which is inserted, a return prevention part for engaging with said modular plug inserted to prevent it from coming off and terminals which function as a terminal connecting part which is electrically connected to the terminals of the modular plug. Said open slit is provided with L-shaped guide members for guiding insertion of said modular plug with their base sides set to be pivotally turnable and said guide members are formed to be freely remountable in said open slit. For inserting the modular plug into the open slit, the guide members are turned to make their L-shaped inner walls serve as the guide surfaces for positioning insertion of the modular plug. Thus the present invention enables to easily and accurately insert the modular plug insert into said open slit and provide a communication card which is not obstructive even when it is kept loaded in a personal computer or the like.

Communication card

A modular jack which is made thin. A hole is pierced in a flat member and a box member is disposed at an opening on one side of the hole. A modular plug is inserted through an opening opposite to the opening where the box member is located. At that time, the insertion direction is regulated by the inner walls of the hole or the inner walls of the box member, push is stopped by a bottom portion of the box member, return is stopped by a hook portion located near the opening through which the modular plug is inserted, and an electrode section is electrically connected to the modular plug. Springs enable only one action to be required.

Modular jack

A card-type line interface device is provided with good portability and low-price. The line interface device includes an adapter unit 1 and a card unit 2 for inserting into the card slot of a communication terminal device. The adapter unit 1 has a card connecting connector 11 on a part of the boxlike body, a line connector 12 on another part thereof, and an interface circuit 14. The adapter unit 1 is connected to the card unit 2 in use, and detached from it on carrying. With no troublesome cable, the line interface device can provide good portability. The reduced number of components and reduced number of assembling steps lead to low price.

Card-type line interface device

A modular jack applicable to a flat assembly. A hole is pierced in a flat member and a cover that can be opened and closed is disposed so as to cover an opening of the hole. When a modular plug is inserted into the hole, the cover is opened; when not, the cover is closed. When the cover is closed, it is housed in the opening, and the modular jack equals the flat member substantially in thickness. When the modular plug is inserted into the hole through the opening with the cover open, the insertion direction of the modular plug is regulated by inner walls of the hole. When the tip of the modular plug abuts against a bottom portion of the hole, the modular plug cannot be inserted any more. In the state, an electrode section located in the hole is electrically connected to electrodes of the modular plug. A hook portion disposed in the cover locks the modular plug so as to prevent the modular plug from easily dropping out of the modular jack even if the modular plug is pulled. If the cover is provided with a lock/release mechanism, the cover can be opened or closed through single finger motion.

Growing community of inventors

Sagamihara, Japan

Masanobu Okada