Mitsui Chemicals, Inc.

Masanobu Maeda

Hiroaki Narisawa

Takaharu Abe

Yasunori Yoshida

Tatsuhiro Urakami

Minoru Hattori

Sunao Maeda

Masahiro Kaneko

Yukio Fukui

Takahiro Yamada

A phenol resin molding material includes a modified olefin-based polymer particle (I) and a phenol resin (II). It is preferable that the modified olefin-based polymer particle (I) satisfy at least one of the requirements (A), (B), and (C) which are defined as follows: (A) Inclusion of at least one element selected from a group consisting of a group 15 element, a group 16 element, and a group 17 element of the periodic table. (B) When the whole of the above-described olefin-based polymer particle (I) is set as 100 wt %, the content of the above-described elements is greater than or equal to 0.05 wt % and less than or equal to 50 wt %. (C) MFR which is measured under the conditions of 190&#xb0; C. and 2.16 kgf based on JIS K 7210 is greater than or equal to 0.001 g/10 minutes and less than 3 g/10 minutes.

Phenol resin molding material, friction material, and phenol resin molded product

A modified phenolic resin that is an alternate copolymer of at least one phenolic compound selected from phenol, naphthols, and their derivatives and a compound having a divalent connecting group, said modified phenolic resin having a side chain attached to an aromatic ring having a hydroxy group, said side chain being represented by defined formula (1-1). The modified phenolic resin can be used as a hardener for epoxy resins and a cured product thereof has excellent adhesion and flame retardancy without impairing properties of conventional phenolic resins such as gel time, glass transition temperature, moisture absorption, and mechanical properties. The epoxy resin composition can provide excellent adhesion and flame retardancy as hardeners for semiconductor sealing epoxy resins, insulating materials for electrical/electronic components, and laminates (printed circuit boards). A prepreg containing a glass substrate impregnated with the epoxy resin composition, a laminate, and an electronic circuit board are also provided.

Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition

A phenolic resin composition which is stable against an environmental moisture change and, further, excellent in fast curing property, flexibility and heat resistance. The phenolic resin composition contains 70-97% by weight of a phenolic resin and 3-30% by weight of a silicone-based rubber component and has a ratio of an ortho-bonding to a para-bonding at a methylene bonding in the phenolic resin of 2-9.

Phenolic resin composition

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Ichihara, Japan

Masanobu Maeda