Hitachi Cable, Inc.

Hitachi Metals, Ltd.

Masanobu Ito

Kouki Hirano

Tomiya Abe

Hiroki Yasuda

Dai Ishikawa

Takami Ushiwata

Hitoshi Horita

Tadayoshi Tsuchiya

Masataka Satoh

A photoelectric conversion module includes a circuit board including a plurality of first board-side electrodes and a plurality of second board-side electrodes that are alternately arranged on a mounting surface of the circuit board in an array direction and each extend into strips in a direction orthogonal to the array direction, a photoelectric conversion array element mounted on the circuit board and including, on a surface facing the mounting surface, a plurality of light receiving/emitting portions, first element-side electrodes connected to the first board-side electrodes and second element-side electrodes connected to the second board-side electrodes, and an IC chip mounted on the circuit board. The circuit board further includes, on the mounting surface, a connecting portion for connecting the first board-side electrodes to each other and a first electrode land portion connected to the first board-side electrode or the connecting portion to contact with a first test electrode probe.

Photoelectric conversion module

A connector supporting structure includes a substrate, a connector mounted on the substrate, and a casing covering at least a portion of the substrate and supporting the connector. The casing includes an opening to expose a part of the connector from an inside of the casing to an outside. Side surfaces of the connector are pressed by inner surfaces of the opening.

Connector supporting structure and connector-equipped electronic device

The invention provides a coaxial cable including an internal insulating layer formed on an outer periphery of an electric conductor, a conductive layer formed on an outer periphery of the internal insulating layer, and an external insulating layer formed on an outer periphery of the conductive layer. The conductive layer is made of a metal nanoparticle paste sintered body obtained by sintering metal nanoparticles by irradiation of light toward a metal nanoparticles paste.

Coaxial cable and manufacturing method of the same

A combined optical and electrical flexible wiring includes a first film substrate, a plurality of conductors aligned parallel on a surface of the first film substrate, an optical fiber provided on the surface of the first film substrate and aligned parallel to the plural conductors, a second film substrate with which the plural conductors and the optical fiber are covered in such a manner as to include an exposed portion, a resin mount provided over the exposed portion in such a manner as to cover the plural conductors and the optical fiber, the resin mount being formed with a light inlet or outlet groove including a mirror surface therein, an optical-electrical conversion component formed on a surface of the resin mount, and a wiring pattern formed on the surface of the resin mount.

Combined optical and electrical flexible wiring and production method therefor

A coaxial cable includes an electric conductor, an insulating layer formed on a periphery of the electric conductor, wherein the insulating layer includes an insulating material including a fluorine-containing polymer obtained by grafting at least one compound selected from unsaturated carboxylic acids and esters of the unsaturated carboxylic acids to a tetrafluoroethylene-perfluoroalkylvinylether copolymer, a conductive layer formed on a periphery of the insulating layer, wherein the conductive layer includes a sintered product from a metallic nanoparticle paste, and an outer insulating layer formed on a periphery of the conductive layer.

Growing community of inventors

Hitachi, Japan

Masanobu Ito