Matsushita Electric Works, Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Masanao Kamakura

Hitoshi Yoshida

Shigeaki Tomonari

Hiroshi Kawada

Kazuhiro Nobutoki

Yoshiki Hayasaki

Jun Ogihara

Masaaki Saito

Shuichi Nagao

Yoshikazu Kuzuoka

Koji Tsuji

Fumihiro Kasano

Hirotaka Matsunami

Osamu Akasaka

Naomasa Oka

Takuro Nakamura

Takuro Ishida

Shota Tsurui

A separating device includes a casing, a rotor, and a blade. The casing has a gas inlet, a gas outlet, and a discharge port for solid substances. The rotor is disposed on an inner side of the casing and is configured to be rotatable around a central axis of rotation of the rotor, the central axis of rotation extending along an axial direction of the casing. The blade is disposed between the casing and the rotor and is configured to rotate together with the rotor. The blade has a first end adjacent to the gas inlet and a second end adjacent to the gas outlet. The casing has a space between the second end of the blade and the discharge port in the axial direction.

Separating device and separating system

A separator includes a rotor, a plurality of flow channels each of which has an inlet and an outlet for gas and are in a vicinity of a rotation axis of the rotor, an air current producer configured to cause gas to flow through the plurality of flow channels, a driving device configured to rotate the rotor to rotate the plurality of flow channels around the rotation axis, and a discharger for allowing discharge of solid materials suspended in airstream produced in each of the plurality of flow channels, in a direction away from the rotation axis.

Separator

A flexible area is joined at one end via a thermal insulation area to a semiconductor substrate which becomes a frame and at an opposite end to a moving element . The thermal insulation area is made of a thermal insulation material a resin such as polyimide or a fluoridated resin. The flexible area is made up of a thin portion S and a thin film M different in thermal expansion coefficient. When a diffused resistor formed on the surface of the thin portion S is heated, the flexible area is displaced because of the thermal expansion difference between the thin portion S and the thin film M, and the moving element is displayed with respect to the semiconductor substrate

Semiconductor device

A flexure transducer element used in an acceleration sensor for sensing an acceleration applied thereto and the method of making the same. The flexure transducer element comprises a frame, a sheet member, a weight, and a support member.

Acceleration sensor element and method of its manufacture

Growing community of inventors

Osaka, Japan

Masanao Kamakura