Kabushiki Kaisha Toshiba

Masamitsu Yahata

Riichiro Shirota

Seiichi Aritome

Yuji Takeuchi

Osamu Ikeda

Hitoshi Araki

Noriyoshi Tozawa

Yuuichiro Murahama

Toshiki Tsushima

Masashi Umemura

In a semiconductor device of MOS structure, the element region has a shape such as a square shape which has a plurality of sides and a plurality of corners. On the element region, a conductive film which constitutes one electrode of the MOS structure is formed. The other electrode of the MOS structure is a silicon substrate. The conductive film is provided so as to cover at least sides adjacent to each other and so as not to cover the corners including the corners which are the contact points (intersecting points) of the adjacent sides. Further, in case the element region is in a ring shape, the conductive film is provided so as to cover none of the corners including the inside corners of the ring-shaped element region. By the above-mentioned structure, the occurrence of breakdown in the insulation film in the MOS structure can be prevented, and the reliability thereof can be enhanced.

Semiconductor device and semiconductor integrated circuit having a conductive film on element region

When the present invention is used for an EPROM, diffused wiring regions for bit lines on a semiconductor substrate, epitaxial layers on the semiconductor substrate and the diffused wiring region, drain diffused regions and source diffused regions on the epitaxial layer are provided, and internal contacts for electrically connecting the diffused wiring regions to the drain diffused regions and the source diffused regions are formed. Contact holes indispensably need a predetermined size so as to preferably conduct, but the wirings are buried in the epitaxial layer to reduce or eliminate the contact holes and to improve integration.

Semiconductor device and method of manufacturing the same

A low-melting point glass sealed semiconductor device comprises a pair of ceramic substrates, each of which is shaped like an arch. The ceramic substrates are overlaid with each other, in such a manner as to define a space between them. Through this space, a gas generated from a thermosetting mounting agent used for adhesion is guided to the outside of the semiconductor device.

Low-melting point glass sealed semiconductor device and method of

Growing community of inventors

Kawasaki, Japan

Masamitsu Yahata