Sumitomo Eaton Nova Corporation

Sumitomo Heavy Industries Ion Technology Co., Ltd.

Sen Corporation, an Shi and Axcelis Company

Masamitsu Shinozuka

Fumiaki Sato

Suguru Hirokawa

Mitsukuni Tsukihara

Michiro Sugitani

Keiji Okada

Junichi Murakami

Yoshitomo Hidaka

A wafer holding device includes a wafer chuck that includes a wafer holding surface coming into contact with a wafer to be held and a plurality of attraction regions provided on the wafer holding surface, and a controller configured to independently control an attraction force of an at least one of the plurality of attraction regions. In a case where fixing of the wafer is released, the controller establishes a temporarily fixing state in which the attraction force of the at least one of the plurality of attraction regions is smaller than an attraction force in fixing the wafer, and thereafter, the controller sets attraction forces of all of the plurality of attraction regions to be smaller than the attraction force in fixing the wafer.

Wafer holding device and wafer chucking and dechucking method

Embodiments of the invention are directed to a method of controlling a mover device The method includes generating a moving force from a moving force generating unit to move a processing base with respect to a movable base, thereby moving the processing base with respect to a fixed base as a result of the movement of the processing base with respect to the movable base; moving the movable base on the fixed base in the opposite direction to the moving direction of the processing base by virtue of a reaction force caused by the moving force generated from the moving force generating unit to move the processing base, so that the movable base moves in the opposite direction to the moving direction of the processing base on the fixed base. The method further includes controlling the moving velocity of the processing base with respect to the fixed base.

Method of controlling mover device

A mover device and an ion implanter apparatus having a processing base that reciprocates at a high speed without undesirable noise and vibration are provided. The mover device includes: a fixed base; a movable base that is linearly movable with respect to the fixed base; a processing base that is linearly movable with respect to the movable base; a main linear motor that generates a moving force to move the processing base with respect to the movable base, thereby moving the processing base with respect to the fixed base; and a velocity control unit that controls the moving velocity of the processing base with respect to the fixed base. In this mover device, the movable base is moved by virtue of a reaction force caused by the moving force to move the processing base.

Mover device and semiconductor manufacturing apparatus and method

A wafer carrying system includes an intermediate cassette device having a plurality of wafer support holders, a robot arm device to carry wafers, an aligner unit to align the wafers, and a wafer feed and storage cassette. The wafers held by the robot arm device are transferred to the aligner unit are aligned in the intermediate cassette device, and are then directly delivered from the aligner unit to the wafer support holders of the intermediate cassette device.

Growing community of inventors

Saijo, Japan

Masamitsu Shinozuka