Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Masamitsu Okamura

Akira Nakamura

Keiichi Fukuda

Chise Nanba

Kazutaka Ikeda

Motoaki Tamaya

Yasuki Kimura

Hideki Yabe

Koji Funaoka

Kei Sasaki

Kaeko Kitamura

Masao Kouhashi

Manabu Kawakami

Takashi Shirase

Hiroshi Takayama

Norihiko Toyoda

Shuichi Maezono

Masakatsu Kawasaki

Toshiaki Kunugi

To constitute an optical module comprising a mount and a board that supports the mount, wherein a solid-state laser device that oscillates fundamental laser light, a pump light source that pumps the solid-state laser device, and a wavelength converting device that converts a wavelength of the fundamental laser light oscillated by the solid-state laser device are mounted on the mount, the mount is divided into three blocks, that is, a first block on which a laser medium is mounted, a second block on which the pump light source is mounted, and a third block on which the wavelength converting device is mounted. A side surface or a bottom surface of only the second block is fixed to the board, the first block is fixed to the other side surface of the second block, and the third block is fixed to a side surface of the first block.

Optical module

When a laser light source module includes a heat sink in which a solid laser element, an excitation light source, and a wavelength conversion element are arranged and a stem that supports the heat sink, wherein the heat sink is separated into three blocks, namely a first block including a laser oscillating unit for the solid laser element is arranged, a second block including a semiconductor laser element that emits excitation light for the laser oscillating unit and a first temperature sensor are arranged and on a specific surface of which the first heater is arranged, and a third block including the wavelength conversion element that converts the wavelength of the fundamental laser beam and a second temperature sensor are arranged and on a specific surface of which a second heater is arranged, enabling thus downsizing of the module and improvement of the positioning accuracy of the elements.

Laser light source module

A sandwich panel is manufactured-by providing: a first step (a), (b) of attaching another end portion of an insert whose one end portion is made sharp to an inner side of a facing member in which a hole is cut in advance; a second step (c) of pressing the insert into the core member such that the one end portion of the insert force-cuts a core member ; and a third step (d) of attaching another facing member to a side of the core member opposing the insert-inserting side thereof.

Sandwich panel and method of manufacturing the sandwich panel

A film-forming method and an apparatus for a X-ray mask and a film-forming apparatus which are able to diminish stress unevenness in the X-ray mask to zero when a X-ray absorber is formed on a mask substrate by sputtering a target 3 during rotation of the mask substrate. Firstly, a dummy mask substrate is prepared instead of a mask substrate. A dummy X-ray absorber 6 is formed on this dummy X-ray substrate 5 within a sputtering range. Secondly, a stress distribution is measured at every position along a straight line passing through a center of the dummy X-ray absorber 6 and then a desirable stress distribution range X is selected at such a location so as to have a good linear characteristic in a portion of a compressive stress curve which decreases toward an outer periphery of the dummy X-ray absorber 6 in the stress distribution. A center of the desirable stress distribution range X is selected as a rotation center, the mask substrate is placed within the desirable stress distribution range X, and the X-ray absorber is formed by this film-forming technology.

Film-forming method for X-ray mask

An electron gun assembling apparatus has a cathode driving mechanism (12,13) for moving a cathode (1), a laser displacement gage (14) to measure a height of a surface of the cathode (1) in a non-contact manner at a cathode surface measuring position outside an electron gun assembly (24), an electric micrometer (11) to measure a height of an upper surface of a first electrode (3) in the electron gun assembly (24), and an electric micrometer (8) to measure a height of a lower surface of a second electrode (4) in the electron gun assembly (24).

Electron gun assembling apparatus and method of assembling electron gun

Growing community of inventors

Tokyo, Japan

Masamitsu Okamura