Texas Instruments Corporation

Masamitsu Matasuura

Anindya Poddar

Mutsumi Masumoto

Woochan Kim

Vivek Kishorechand Arora

Hau Thanh Nguyen

Kengo Aoya

Hideaki Matsunaga

In one example, embedded die package, including a layer having an exposed boundary, wherein at least a portion of the exposed boundary comprises organic material. The package also includes at least one integrated circuit die positioned in the layer and within the exposed boundary. The package also includes a dielectric material positioned in the layer and between the at least one integrated circuit and structure adjacent the at least one integrated circuit.

Frame design in embedded die package

Growing community of inventors

Beppu, Japan

Masamitsu Matasuura