Komatsu Corporation

Kabushiki Kaisha Komatsu Seisakusho

Sumco Techxiv Corporation

Masamitsu Kitahashi

Iwao Kurokawa

Hiroyuki Tokunaga

Mikio Minonishi

Toshiyuki Kamei

Hidetoshi Takeda

Tamoaki Tajiri

Yoshihiro Yamaguchi

Hiroshi Takada

Kunio Horiai

Hiroyuki Tokynaya

Mikio Tokunaga

A display method includes: acquiring a visible light image of a first target captured by a visible light imaging device; acquiring an infrared image of a second target captured by an infrared imaging device; calculating a visible light distance from the visible light imaging device to the first target for each of first partitioned areas defined in the visible light image; calculating an infrared distance from the infrared imaging device to the second target for each of second partitioned areas defined in the infrared image to correspond to the first partitioned areas; determining whether a difference between the visible light distance and the infrared distance is larger than a threshold for one of the first partitioned areas and one of the second partitioned areas corresponding to each other; combining the second partitioned area in which the difference is larger than the threshold with the visible light image to be displayed.

Display system and display method

A polishing apparatus comprises a polishing plate (), an abrasive cloth () attached to the surface of the polishing plate (), a chuck () for holding and pressing one surface of a wafer () against the abrasive cloth (), and a circular retaining ring () concentrically arranged on the periphery of the chuck (). The retaining ring () is rotatable and vertically movable with respect to the chuck (), and is pressed against the abrasive cloth () during the lapping step. The retaining ring () is lifted upward during the final polishing step, thereby preventing lapping grains from being brought into the final polishing stage. Accordingly, lapping and final polishing can be successively conducted using the same polishing head. With this structure, cost cutting of the apparatus can be realized, since lapping and final polishing are successively conducted using the same polishing head without bringing the lapping grains used for lapping into the final polishing stage.

Growing community of inventors

Kanagawa-ken, Japan

Masamitsu Kitahashi