Sumitomo Electric Industries, Limited

Hirakawa Guidom Corporation

Sumitomo Electric Printed Circuits, Inc.

Hirakawa Iron Works, Ltd.

Masamichi Yamamoto

Hiroshi Kobayashi

Yoshiharu Ueda

Yasuhiro Okuda

Kyouichirou Nakatsugi

Hideaki Toshioka

Keiryo Tou

Hiroshi Ueda

Takashi Kasuga

Hideki Kashihara

Kayo Hashizume

Atsumi Kaminashi

Masanari Kinoshita

Seikan Ishigai

Sentaro Miura

Kiyoshi Furushima

Masatoshi Majima

Yoshio Oka

Takashi Yamaguchi

Jun Yorita

Tatsuo Matsuda

Keiji Koyama

Junichi Okaue

Ayao Kariya

Katsunari Mikage

Ippei Tanaka

Kazuhiro Kawabata

Yoshie Tani

Misako Osoegawa

Shigeki Kawakami

Michihiro Kimura

Katsuhiro Satou

Yugo Kubo

A shielded flat cable includes a first differential signal line pair including mutually parallel first and second signal lines, first and second ground lines parallel to the first differential signal line pair arranged between the first and second ground lines, an insulating layer covering the first differential signal line pair, the first and second ground lines, a first shielding layer covering a first surface of the insulating layer, and a second shielding layer covering a second surface of the insulating layer, opposite to the first surface. The insulating layer includes an opening exposing the first ground line at the first surface of the insulating layer, and the first shielding layer is electrically connected to the first ground line through the opening. A width of the first ground line is greater than a width of each of the first and second signal lines.

Shielded flat cable and shielded flat cable with circuit board

A base material for a printed circuit board includes a base film having an insulating property, and a sintered body layer including metal particles and layered on at least one surface of the base film. The sintered body layer includes sintered particles that are derived from the metal particles and partially embedded into the surface of the base film. The embedment ratio of the sintered particles is greater than or equal to 10% and less than or equal to 90%.

Base material for printed circuit board and method of manufacturing base material for printed circuit board

According to one aspect of the present disclosure, a printed circuit board includes: an insulating base film; and a plurality of wiring portions formed on a surface of the base film, wherein the wiring portions include a seed layer that is directly or indirectly layered on the surface of the base film and a metal layer that is layered on the seed layer, wherein the base film has a wiring area including the plurality of wiring portions and a non-wiring area not including the wiring portions, wherein the plurality of wiring portions include at least one outermost boundary wiring portion and a plurality of inner wiring portions other than the outermost boundary wiring portion, wherein the outermost boundary wiring portion is formed on an outermost side of the base film in the wiring area and at a boundary between the wiring area and the non-wiring area, wherein an average width of the outermost boundary wiring portion is 30 μm or more, wherein an average width of the inner wiring portions is 20 μm or less, and wherein an average aspect ratio of the inner wiring portions is 1.5 or more.

Printed circuit board and method of manufacturing printed circuit board

A flexible printed circuit board of the present invention includes an insulating base film and an electrode stacked on a first surface of the base film, in which the electrode includes a low-melting-point metal layer on a surface of the electrode, and a plate- or strip-like rigid member electrically insulated from the electrode is disposed in a region of a second surface of the base film opposite from the electrode.

Flexible printed circuit board, method for producing connection body, and connection body

A resin film according to one aspect of the present invention is a resin film having polyimide as a main component, the resin film including a modified layer formed in a depth direction from at least one side of the resin film; and a non-modified layer other than the modified layer, wherein a ring-opening rate of an imide ring of the polyimide in the modified layer is higher than a ring-opening rate of an imide ring of the polyimide in the non-modified layer, and an average thickness of the modified layer from the one side of the resin film is greater than or equal to 10 nm and less than or equal to 500 nm.

Resin film, substrate for printed wiring board, and printed wiring board

By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrodeand a second connecting electrodeare connected together through a conductive adhesivethat is interposed between the electrodes, includes an organic film formation step in which an organic filmis formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device

There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.

Electrode structure, wiring body, adhesive connection structure, electronic device, and method for fabricating same

The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boardsandelectrically connects a plurality of first electrodesandprovided to be adjacent to each other on a first boardwith a plurality of second electrodesandprovided to be adjacent to each other on a second boardthrough an adhesivethat contains conductive particlesand that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrodeand second electrodeand between the mutually facing first electrodeand second electrode, an adhesive layeris formed between the first boardand the second boardand in the adhesive layer, a cavity portionis formed between the first electrodesandand between the second electrodesand

Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity

There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrodeand a second connection electrodeare connected to each other with a conductive adhesive layertherebetween includes organic filmsandformed on at least the first connection electrode and conductive particlescontained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.

Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatus

An anisotropic conductive filmcontains electrically conductive particlesdispersed in an adhesive agentfor electrode connection, the adhesive agent containing an epoxy resin, which is an insulating thermosetting resin, as a main component, a phenoxy resin having a molecular weight of 30,000 or more, a latent hardener, a polyvinyl butyral resin having a glass-transition temperature of 100&#xb0; C. or higher, and a polyvinyl butyral resin having a glass-transition temperature of 90&#xb0; C. or lower. There is provided the high-heat-resistant anisotropic conductive film which suppresses a reduction in repairability and which can be used for electrodes having a finer pitch, i.e., having a minimum pitch of 150 &#x3bc;m or less, when electrodes are connected with the anisotropic conductive film.

Anisotropic conductive film

An anisotropic conductive adhesive is provided that includes an epoxy resin, a phenoxy resin, a curing agent, an inorganic filler, and conducting particles as components. The phenoxy resin is controlled to have a glass-transition temperature (Tg) in a range of 66&#xb0; C. to 100&#xb0; C., so that the anisotropic conductive adhesive has an excellent fluidity in a mounting process, satisfactory electric conductive/insulation performances, and sufficient adhesiveness. Since the properties of the anisotropic conductive adhesive are almost invariant even if the adhesive is used for a long time under a high-temperature- and high-humidity condition, the anisotropic conductive adhesive can be used for applications where a high reliability is required.

Anisotropic conductive adhesive

A circuit coupling adhesive which is superior in heat resistance and moisture resistance is provided. The circuit coupling adhesive of the present invention can be used for purposes where high performing reliability is required, since it exhibits satisfactory electroconductive/insulative performance at connection of electrodes, etc. and the characteristics will not be varied so much even after a long period of use in a high temperature and high humidity environment. The circuit coupling adhesive comprises, as the essential ingredients, an epoxy resin, a latent curing agent, inorganic fillers having an average particle diameter of 500 nm or less, and electro-conductive particles. By mix a sufficient amount of inorganic fillers having an average particle diameter of 500 nm or less, the coefficient of thermal expansion can be decreased and the heat resistance and moisture resistance can be improved.

Circuit connecting adhesive

An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 &#x3bc;m-20 &#x3bc;m when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

Anisotropic conductive film and method for producing the same

In a combustion device, a boiler is provided with a water tube nest in which combustion, flame holding, fuel-air mixing, and heat absorption are carried out by each water tube in a tube nest. The arrangement of this combustion device enables elimination of the conventional burner and furnace. Fuel supply devices are provided upstream of the water tube nest to supply fuel or a fuel-air mixture. One or several combustion catalysts are provided across the gas flow direction in the boiler to promote combustion. In one arrangement, the fuel supply devices are fuel supply tubes, and fuel or fuel and air are supplied to the fuel supply tubes and spouted from fuel injection nozzles thereof. The fuel supply tubes and water tubes are arranged such that the row of fuel supply tubes is spaced upstream from the first water tube row, such that L.gtoreq.3D where L is the pitch between the fuel supply tube row and the first water tube row, and D is the diameter of the water tubes. Also, P.gtoreq.2D where P is a longitudinal pitch between the water tube rows. A suitable number of fins having a suitable angle and height can be provided on the water tubes and/or the fuel supply tubes. U-shaped or other openings can be made in the fins.

Combustion device in tube nested boiler and its method of combustion

In a combustion device, a boiler is provided with a water tube nest in which combustion, flame holding, fuel-air mixing, and heat absorption are carried out by each water tube in a tube nest. The arrangement of this combustion device enables elimination of the conventional burner and furnace. Fuel supply devices are provided upstream of the water tube nest to supply fuel or a fuel-air mixture. One or several combustion catalysts are provided across the gas flow direction in the boiler to promote combustion. In one arrangement, the fuel supply devices are fuel supply tubes, and fuel or fuel and air are supplied to the fuel supply tubes and spouted from fuel injection nozzles thereof. The fuel supply tubes and water tubes are arranged such that the row of fuel supply tubes is spaced upstream from the first water tube row, such that L.gtoreq.3D where L is the pitch between the fuel supply tube row and the first water tube row, and D is the diameter of the water tubes. Also, P .gtoreq.2D where P is a longitudinal pitch between the water tube rows. A suitable number of fins having a suitable angle and height can be provided on the water tubes and/or the fuel supply tubes. U-shaped or other openings can be made in the fins.

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Osaka, Japan

Masamichi Yamamoto