Growing community of inventors

Himeji, Japan

Masamichi Nishimura

Average Co-Inventor Count = 3.36

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 3

Masamichi NishimuraKiyoharu Tsutsumi (4 patents)Masamichi NishimuraKeizo Inoue (3 patents)Masamichi NishimuraTakahiro Iwahama (3 patents)Masamichi NishimuraHiroshi Koyama (2 patents)Masamichi NishimuraAkira Eguchi (2 patents)Masamichi NishimuraTomoyuki Hirano (1 patent)Masamichi NishimuraYoshiyuki Utsumi (1 patent)Masamichi NishimuraYoshitaka Komuro (1 patent)Masamichi NishimuraMitsuru Ohno (1 patent)Masamichi NishimuraNaoki Yamashita (1 patent)Masamichi NishimuraMasamichi Nishimura (7 patents)Kiyoharu TsutsumiKiyoharu Tsutsumi (18 patents)Keizo InoueKeizo Inoue (39 patents)Takahiro IwahamaTakahiro Iwahama (19 patents)Hiroshi KoyamaHiroshi Koyama (14 patents)Akira EguchiAkira Eguchi (4 patents)Tomoyuki HiranoTomoyuki Hirano (86 patents)Yoshiyuki UtsumiYoshiyuki Utsumi (71 patents)Yoshitaka KomuroYoshitaka Komuro (42 patents)Mitsuru OhnoMitsuru Ohno (14 patents)Naoki YamashitaNaoki Yamashita (8 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Daicel Chemical Industries, Ltd. (5 from 1,165 patents)

2. Daicel Corporation (2 from 638 patents)

3. Tokyo Ohka Kogyo Co., Ltd. (1 from 1,233 patents)


7 patents:

1. 9862695 - Monomer having N-acyl carbamoyl group and lactone skeleton, and polymeric compound

2. 9261785 - Polymer compound, resin composition for photoresists, and method for producing semiconductor

3. 8753793 - Method for producing resin solution for photoresist, photoresist composition, and pattern-forming method

4. 8236971 - Polycyclic ester containing cyano group and lactone skeleton

5. 7834114 - Polycyclic ester containing cyano group and lactone skeleton

6. 7750101 - Polycyclic ester containing cyano group and lactone skeleton

7. 7033726 - Photoresist polymeric compound and photoresist resin composition

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as of
12/4/2025
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