Fujitsu Corporation

Fujitsu Semiconductor Limited

Masamichi Fujimoto

Masanori Takahashi

Haruo Kojima

Yuichi Asano

Hiroshi Ohtsubo

Katsunori Wako

Youhei Nagahama

Yuki Yasuda

Akihiro Kubota

Shuji Mori

In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin.

Method of manufacturing a semiconductor using a rigid substrate

Method of manufacturing a semiconductor device using a rigid substrate including the vent-end edge portion of the substrate has a thickness smaller than the other portions of the substrate

A press punching apparatus makes many holes at the same time and changes an arrangement of the holes without changing a punch block and a die block. A punching mold is provided with a plurality of punches having different lengths. A travel distance of the mold is adjusted so that a first part of the punches penetrates a work piece to be punched in a first stroke. Then, the travel distance of the mold is changed so that the work piece is punched by a second part of the punches other than the first part of the punches in a second stroke.

Press punching method and apparatus for forming a plurality of through holes by changing a travel distance of a punching mold

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Aizuwakamatsu, Japan

Masamichi Fujimoto