Hitachi Chemical Company, Ltd.

Other

Sharp Corporation

Hitachi Co., Ltd

Masami Yusa

Yasuo Miyadera

Shinji Takeda

Takashi Masuko

Akira Kageyama

Iwao Maekawa

Aizou Kaneda

Tooru Kikuchi

Shigeki Katogi

Mitsuo Yamasaki

Tohru Fujinawa

Satoyuki Nomura

Hiroshi Ono

Hiroyuki Izawa

Hoko Kanazawa

Houko Sutou

Fumio Inoue

Isao Tsukagoshi

Yasushi Gotou

Toshihiko Kato

Shigeki Ichimura

Itsuo Watanabe

Yoshiki Sota

Motohiro Arifuku

Hidehiro Nakamura

Yoshiaki Tsubomatsu

Yorio Iwasaki

Toshio Yamazaki

Katsuji Shibata

Mitsuo Yamazaki

Koji Miyata

Toshiaki Shirasaka

Akio Kotato

Makoto Saitou

Tadaji Satou

Yasuhiko Awano

Mituo Yamasaki

Yuusuke Miyamae

Hoko Suto

Takanobu Kobayashi

Akira Nagai

Nobuo Miyadera

Mitsumasa Kojima

Hidetaka Satou

Masatoshi Yoshida

Minoru Sugiura

Satoru Oota

Masahiro Kawakami

Hideyuki Hashimoto

The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane(meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.

Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device

The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.

Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins.

Film-like adhesive, adhesive sheet, and semiconductor device using same

There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure

An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200&#xb0; C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa&#xb7;s at 25&#xb0; C.

Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device

A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250&#xb0; C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Semiconductor device and process for fabrication thereof

The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I):  

Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure

An adhesive film including a reactive adhesive capable of curing by heating or light irradiation and a polyphthalide represented by the formula I: wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, Rrepresents an alkyl group, a Fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of Ris 0 to 4, X represents O or N&#x2014;R, provided that Rrepresents one of the following groups, Y represents SOor CO and n represents a number of repeating units in the polymer. The adhesive film can be used to connect, e.g., electrodes of a semiconductor chip to electrodes of a wiring board. The polyphthalide can be used to surface-treat, e.g., electrodes of a wiring board.

Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure

The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

Wiring-connecting material and wiring-connected board production process using the same

Growing community of inventors

Tsukuba, Japan

Masami Yusa