Murata Manufacturing Co., Ltd.

Other

Murata Mfg. Co., Ltd.

Masami Yamaguchi

Tadahiro Nakagawa

Koichi Nitta

Masatoshi Arishiro

Kazuma Kabuta

Haruhumi Mandai

Tetsuro Saito

Katsuyuki Moriyasu

Kunitaro Nishimura

Yoshiaki Kohno

Kenji Minowa

Michio Kaeriyama

Isamu Kanamori

Kiyota Nakai

Haruo Hori

A manufacturing apparatus for manufacturing electronic monolithic ceramic components, including a sheet supplier for supplying a plurality of ceramic green sheets of a plurality of types in a predetermined order, and a laminator for laminating the ceramic green sheets supplied by the sheet supplier. A plurality of trays is set in two vertical columns in a rack which is vertically movable. Each tray holds a stack of a plurality of ceramic green sheets of the same type. A particular tray positioned to a predetermined level by the vertical movement of the rack is drawn by a tray drawer device, and one ceramic green sheet is picked up from the tray, and is then conveyed to the laminator. The utilization efficiency of area in the sheet supplier is thus increased.

Manufacturing apparatus for manufacturing electronic monolithic ceramic components

A thick layer of electrode material paint is formed on a flat surface. A film of the electrode material paint is formed on an element by dipping the element into the layer. In the next step, a thinner layer of the electrode material paint than the aforementioned layer is formed on a flat surface. Into the thinner layer of the electrode material paint, the film of the electrode material paint formed on the element is dipped. Alternatively, the element may first be dipped into a thinner layer of the electrode material paint so that a thin film of the electrode material paint is formed on the element. The film formed on the element is then dipped into a thick layer of the electrode material paint and then again into a thin layer of the electrode material paint in such order. By firing the film of the electrode material paint obtained in this manner, an electronic element having external electrodes of a uniform thickness can be obtained.

Method of manufacturing electronic elements

An electronic component chip holder employed for coating metallized surfaces on both longitudinal ends of a plurality of electronic component chips with a metal such as solder, while holding the same. The holder comprises a plurality of holding portions for holding the electronic component chips one by one. Each of the holding portions is defined by a through hole, and each of the electronic component chips is inserted in the holding so as to be longitudinally aligned with the axis of the through hole. An elastic member is formed on an inner peripheral surface defining each holding portion, to elastically hold a longitudinal intermediate portion of each electronic component chip. A plurality of electronic component chips thus held by the holder are collectively dipped in a molten bath of a metal such as solder, so that coating films of such a metal are formed on the metallized surfaces.

Method of performing metal coating on metallized surfaces of electronic

A component-orienting apparatus provided with a plurality of parallel orienting passages for aligning a plurality of components such as rectangular-parallelopipedic electronic component chips in the same orientation as each other. Each of the orienting passages comprises a receiving portion provided with a first space defined by an upwardly-taperingly-opening first inner peripheral surface and an aligning passage having a cylindrical second inner peripheral surface defining a second space that communicates with the lower end of the first space. The aligning passage is selected to have sectional geometry which rejects the longitudinal dimension of each component but crosswisely and perpendicularly orients the component in prescribed directions respectively. The first inner peripheral surface is continuous with the second inner peripheral surface through a rounded face.

Component-orienting apparatus

An electrode application tool is disclosed for applying of electrode paste to end surfaces of electronic components or collective bodies of electronic components simultaneously at one time. the electrode application tool is designed to have many longitudinal grooves formed in the opposite lateral side surfaces of a main body frame of the application tool so as to accommodate end portions of electronic components or collective bodies of electronic components, and two pairs of upper and lower plate-like elastic members provided so as to cover the upper part and the lower part of the longitudinal grooves, respectively, at least one of each pair allows the longitudinal grooves to be opened, thereby improving productivity of electronic components.

Electrode application tool

A chip component holding plate includes a sheet member composed of silicon rubber, on which a number of quadrilateral through holes each of which is capable of holding a chip component therein are formed. A plate composed of stainless steel is formed on one main surface of the sheet member. On the stainless steel plate, a number of circular through holes each of which has a diameter larger than an inside width of each quadrilateral through holes of the sheet member are formed at positions respectively corresponding to the respective through holes of the sheet member. In the state that the chip components are respectively press-inserted into the respective through holes of the sheet member, the stainless steel plate is magnetically attracted by a magnet plate. Then, the magnet plate is moved so that end portions of the respective chip components being held by the sheet member are pressed onto a silver paste which is spread on a plate, whereby an electrode is applied on the end portion of each chip component.

Chip component holding plate

A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts. The method includes providing first and second holding plates having elastic material provided with a plurality of chip receiving holes passing therethrough from the front side to the reverse side thereof, pushing chip parts into the receiving holes in the first holding plate from the front side thereof a distance only sufficient to have the one ends of said chip parts exposed at the front surface of the first holding plate, coating the one ends of the chip parts which are exposed at the front surface of the first holding plate, with an electrode material, placing the front surface of the first holding plate in spaced opposed relationship to the front surface of the second holding plate with the receiving holes in the respective holding plates aligned, pushing the other ends of the chip parts held by the first holding plate to transfer the chip parts into the receiving holes in the second holding plate with the one ends which are coated with the electrode material sufficiently far into the receiving holes of the second holding plate to leave the other ends of the chip parts which are not coated with electrode material exposed at the front surface of the second holding plate, coating the other ends of the chip parts which are exposed at the front surface of the second holding plate with an electrode material, and pushing the chip parts out of the second holding plate by pushing on the one ends of the chip parts from inside the receiving holes of the second holding plate.

Tool for forming external electrodes of chip parts

A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts. The method includes providing first and second holding plates having elastic material provided with a plurality of chip receiving holes passing therethrough from the front side to the reverse side thereof, pushing chip parts into the receiving holes in the first holding plate from the front side thereof a distance only sufficient to have the one ends of said chip parts exposed at the front surface of the first holding plate, coating the one ends of the chip parts which are exposed at the front surface of the first holding plate with an electrode material, placing the front surface of the first holding plate in spaced opposed relationship to the front surface of the second holding plate with the receiving holes in the respective holding plates aligned, pushing the other ends of the chip parts held by the first holding plate to transfer the chip parts into the receiving holes in the second holding plate with the one ends which are coated with the electrode material sufficiently far into the receiving holes of the second holding plate to leave the other ends of the chip parts which are not coated with electrode material exposed at the front surface of the second holding plate, coating the other ends of the chip parts which are exposed at the front surface of the second holding plate with an electrode material, and pushing the chip parts out of the second holding plate by pushing on the one ends of the chip parts from inside the receiving holes of the second holding plate.

Method of forming external electrodes of chip parts and tool for

A lampshade made in accordance with this invention is characterized in that it consists solely of a plurality of comparatively thin sheets of a same shape corresponding to a front vertical cross-sectional view of the lampshade or a vertically cut out half of said view. Each sheets has strips which are aligned in parallel with each other, and each strip has a base portion located adjacently to an outer contour of the sheet and a free end located oppositely to the base portion. When the plurality of sheets bound together at least at upper ends thereof are framed to the lampshade, they extend radially outwardly with a desired angular distance therebetween and strips thereof bridge over the outer contours of the sheets.

Lampshade

A boundary layer type semiconducting ceramic capacitor with high capacitance is disclosed. The capacitor comprises a semiconducting ceramic body in which grain boundaries on crystal grains of the semiconducting ceramic body are insulated, characterized in that said semiconducting ceramic body has a composition consisting essentially of 98.1 to 99.88 mole % of a main component (Sr.sub.1-x Ba.sub.x)Tio.sub.3 or (Sr.sub.1-x Ba.sub.x)TiO.sub.3 modified with a titanete and/or a zirconate, wherein x is a mole fraction of Ba and takes a value ranging from 0.30 to 0.50, and 0.1 to 1.0 mole % of at least one semiconductorizing agent selected from the group consisting of rare earth elements, Nb, Ta and W, and that said grain boundaries of the crystal grains are insulated by at least one insulating agent selected from the group consisting of Mn, Bi, Cu, Pb, B and Si, and that the maximum crystal grain present in the semiconducting ceramic body has a grain size ranging from 100 to 250.mu.. The composition contains 0.02 to 0.2 mole % of Mn as a mineralizing agent or insulating agent. The composition may further contain at least one of 0.05 to 0.5 mole % of SiO.sub.2 and 0.02 to 0.2 mole % of Al.sub.2 O.sub.3.

Boundary layer type semiconducting ceramic capacitors with high

A method for producing boundary layer semiconductor ceramic capacitors comprises firing shaped bodies of a semiconductor ceramic material in a neutral or reducing atmosphere, heat-treating the resultant semiconductor ceramic bodies to insulatorize crystal grain boundaries of the semiconductor ceramics, and providing opposite electrodes on surfaces of the heat-treated semiconductor ceramic bodies and is characterized in that said heat-treating is carried out by heating the semiconductor ceramic bodies together with power of an insulatorizing agent with stirring in a neutral or oxidizing atmosphere at a temperature ranging from 950.degree. to 1300.degree. C. As a semiconductor ceramic material, there may be used semiconductor ceramics of a barium titanate system, or of a strontium titanate system, or a complex semiconductor ceramic mainly comprising barium titanate or calcium titanate and strontium titanate. This method enables one to produce boundary layer semiconductor ceramics as good quality with small standard deviation and high yield.

Growing community of inventors

Nagaokakyo, Japan

Masami Yamaguchi