Toyoda Gosei Co., Ltd.

Masami Yamada

Masahiro Nozaki

Keizo Hayashi

Naoki Shibata

Masayoshi Koike

Michinari Sassa

Makoto Tamaki

Hisayuki Kisanuki

Takahide Oshio

A light-emitting semiconductor device (10) consecutively has a sapphire substrate (1), an AlN buffer layer (2), a silicon (Si) doped GaN n.sup.+ -layer (3) of high carrier (n-type) concentration, a Si-doped (Al.sub.X2 Ga.sub.1-x2).sub.y2 In.sub.1-y2 N n.sup.+ -layer (4) of high carrier (n-type) concentration, a zinc (Zn) and Si-doped (Al.sub.x1 Ga.sub.1-x1).sub.y1 In.sub.1-y1 N emission layer (5), and a Mg-doped (Al.sub.x2 Ga.sub.1-x2).sub.y2 In.sub.1-y2 N p-layer (6). The AlN buffer layer (2) has a 500 .ANG. thickness. The GaN n.sup.+ -layer (3) is about 2.0 .mu.m thick and has a 2.times.10.sup.18 /cm.sup.3 electron concentration. The n.sup.+ -layer (4) is about 2.0 .mu.m thick and has a 2.times.10.sup.18 /cm.sup.3 electron concentration. The emission layer (5) is about 0.5 .mu.m thick. The p-layer 6 is about 1.0 .mu.m thick and has a 2.times.10.sup.17 /cm.sup.3 hole concentration. Nickel electrodes (7, 8) are connected to the p-layer (6) and n.sup.+ -layer (4), respectively. A groove (9) electrically insulates the electrodes (7, 8). Lead lines (21, 22) are connected with the electrodes (7, 8) by a wedge bonding method to desirably reduce the surface area of the electrodes on the light-emitting side of the device upon which the electrodes are situated to thereby increase light emission from the device.

Light-emitting semiconductor device using group III nitride compound

The present invention is directed to a door weather strip in which the corner portions thereof are integrally formed with straight portions thereof. In order to obtain a predetermined sealing interference, the cross sectional shape of the corner portions of hollow sealing portion and the lip seal of the weather strip is arranged to be longer than that in the straight portion. Alternatively, the sealing portion is raised as to have a predetermined shape when the corners are formed. Said formed shapes are solidified by vulcanization after the weather strip has been plastically deformed before the vulcanization.

Method of manufacturing a door weather strip

The present invention is directed to a door weather strip in which the corner portions thereof are integrally formed with straight portions thereof. In order to obtain a predetermined sealing interference, the cross sectional shape of the corner portions of hollow sealing portion and the lip seal of the weather strip is arranged to be longer than that in the straight portion. Alternatively, the sealing portion is raised as to have a predetermined shape when the corners are formed. Said formed shapes are solidified by vulcanization after the weather strip has been plastic deformed before the vulcanization.

Door weather strip

In a weather strip for vehicles which is made up of a mounting base portion for clamping the flange of a door sash, a glass plate holding portion for sealingly holding the periphery of a door glass plate, and a bend lip portion for sealingly push the door glass plate, a supporting lip is extended from the outer wall of the mounting base portion towards the inner shoulder of the glass plate holding portion, so that the glass plate holding portion is sufficiently abutted against the sash inner peripheral wall when installed and sink marks in the mounting base portion are held behind the supporting lip.

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Aichi, Japan

Masami Yamada